Inventor
Masahiro Yonemochi
Inventor
Nagano, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1063%
H01LSemiconductor devices13%
H05KPrinted circuits13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
9,184,106'Heat sink and semiconductor device'20158,587,947'Heat spreader for IC package, and IC package clamper having the heat spreader'20136,818,476'Insert-moldable heat spreader, semiconductor device using same, and method for manufacturing such semiconductor device'20046,339,261'Semiconductor device and process of producing same'20026,204,162'Production of semiconductor device'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2015Patents assigned to SHINKO ELECTRIC IND CO (5)· patent assignee history
2001–2015Based in Nagano, JP· patent location history
2002Patents assigned to FUJITSU LTD (1)· patent assignee history
2013Patents assigned to YONEMOCHI MASAHIRO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 5 | 2001–2015 |
| FUJITSU LTD | 1 | 2002 |
| YONEMOCHI MASAHIROself | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 5 | 2001–2015 |