Inventor
Ellen Schwartz Tormey
Inventor
Princeton Junction, NJ, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
Y10TTechnical subjects covered by former us classification13%
H05KPrinted circuits11%
C03CChemical composition of glasses, glazes or vitreous enamels9%
H01CResistors5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
C04BLime, magnesia4%
B23KSoldering or unsoldering3%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
PatentTitleYear
10,625,356Electrical connection tape202010,562,809Low K dielectric compositions for high frequency applications202010,465,295Jettable inks for solar cell and semiconductor fabrication20199,801,285'Solder preforms and solder alloy assembly methods'20178,192,047'High color rendering index white LED light system using multi-wavelength pump sources and mixed phosphors'20127,183,640'Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards'20076,739,047'Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate'20046,713,862'Low temperature co-fired ceramic-metal packaging technology'20046,551,720'Materials to fabricate a high resolution plasma display back panel'20036,518,502'Ceramic multilayer circuit boards mounted on a patterned metal support substrate'20036,455,930'Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology'20026,399,230'Multilayer ceramic circuit boards with embedded resistors'20026,191,934'High dielectric constant embedded capacitors'20016,055,151'Multilayer ceramic circuit boards including embedded components'20006,017,642'Low dielectric loss glasses'20005,958,807'Low dielectric loss glass ceramic compositions'19995,953,203'Multilayer ceramic circuit boards including embedded capacitors'19995,929,510'Integrated electronic circuit'19995,866,240'Thick ceramic on metal multilayer circuit board'19995,725,808'Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board'19985,514,451'Conductive via fill inks for ceramic multilayer circuit boards on support substrates'19964,769,294'Alumina materials for low temperature co-sintering with refractory metallization'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988Based in Tyngsboro, MA, US· patent location history
1996–1998Patents assigned to SARNOFF DAVID RES CENTER (2)· patent assignee history
1996–2020Based in Princeton Junction, NJ, US· patent location history
1998–2002Patents assigned to SHARP KK (6)· patent assignee history
1999–2003Patents assigned to SARNOFF CORP (8)· patent assignee history
1999–2002Based in Princeton, NJ, US· patent location history
2002–2007Patents assigned to LAMINA CERAMICS INC (3)· patent assignee history
2017–2020Patents assigned to ALPHA ASSEMBLY SOLUTIONS INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SARNOFF CORP | 8 | 1999–2003 |
| SHARP KK | 6 | 1998–2002 |
| ALPHA ASSEMBLY SOLUTIONS INC | 3 | 2017–2020 |
| LAMINA CERAMICS INC | 3 | 2002–2007 |
| SARNOFF DAVID RES CENTER | 2 | 1996–1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Princeton Junction, New Jersey, US | 19 | 1996–2020 |
| Princeton, New Jersey, US | 2 | 1999–2002 |
| Tyngsboro, Massachusetts, US | 1 | 1988 |