Inventor
William K. Barth
Inventor
Gresham, OR, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1055%
B82YSpecific uses or applications of nanostructures9%
G11CStatic stores9%
H10BElectronic memory devices9%
H10KOrganic electric solid-state devices9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
PatentTitleYear
7,312,532'Dual damascene interconnect structure with improved electro migration lifetimes'20077,160,805'Inter-layer interconnection structure for large electrical connections'20077,033,929'Dual damascene interconnect structure with improved electro migration lifetimes'20066,998,343'Method for creating barrier layers for copper diffusion'20066,969,651'Layout design and process to form nanotube cell for nanotube memory applications'20056,838,379'PROCESS FOR REDUCING IMPURITY LEVELS, STRESS, AND RESISTIVITY, AND INCREASING GRAIN SIZE OF COPPER FILLER IN TRENCHES AND VIAS OF INTEGRATED CIRCUIT STRUCTURES TO ENHANCE ELECTRICAL PERFORMANCE OF COPPER FILLER'20056,642,597'Inter-layer interconnection structure for large electrical connections'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2007Patents assigned to LSI LOGIC CORP (6)· patent assignee history
2003–2007Based in Gresham, OR, US· patent location history
2007Patents assigned to LSI CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LSI LOGIC CORP | 6 | 2003–2007 |
| LSI CORP | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gresham, OR, US | 7 | 2003–2007 |