Inventor
Denis Endisch
Inventor
Cupertino, CA, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
B81BMicrostructural devices or systems, e.g. micromechanical devices10%
G02BOptical elements, systems or apparatus10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
G06FElectric digital data processing6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
Y10TTechnical subjects covered by former us classification6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
B82YSpecific uses or applications of nanostructures4%
PatentTitleYear
11,079,810Flexible cable durability202110,784,062Ingress prevention for keyboards202010,671,127Peripheral housing for a computing device202010,466,749Peripheral housing for a computing device20199,001,412'Electromechanical device with optical function separated from mechanical and electrical function'20158,475,666'Method for making toughening agent materials'20138,368,997'Electromechanical device with optical function separated from mechanical and electrical function'20138,289,613'Electromechanical device with optical function separated from mechanical and electrical function'20127,944,599'Electromechanical device with optical function separated from mechanical and electrical function'20117,920,319'Electromechanical device with optical function separated from mechanical and electrical function'20117,678,712'Vapor phase treatment of dielectric materials'20107,630,121'Electromechanical device with optical function separated from mechanical and electrical function'20097,612,932'Microelectromechanical device with optical function separated from mechanical and electrical function'20097,153,783'Materials with enhanced properties for shallow trench isolation/premetal dielectric applications'20066,967,172'Colloidal silica composite films for premetal dielectric applications'20056,815,371'Edge bead removal for spin-on materials containing low volatility solvents using carbon dioxide cleaning'20046,797,607'Contact planarization using nanoporous silica materials'20046,653,718'Dielectric films for narrow gap-fill applications'20036,589,889'Contact planarization using nanoporous silica materials'20036,565,920'Edge bead removal for spin-on materials containing low volatility solvents fusing carbon dioxide cleaning'20036,444,495'Dielectric films for narrow gap-fill applications'20026,407,006'Method for integrated circuit planarization'20026,140,254'Edge bead removal for nanoporous dielectric silica coatings'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2004Patents assigned to ALLIED SIGNAL INC (3)· patent assignee history
2000–2021Based in Cupertino, CA, US· patent location history
2002–2013Patents assigned to HONEYWELL INT INC (9)· patent assignee history
2009–2015Patents assigned to QUALCOMM MEMS TECHNOLOGIES INC (6)· patent assignee history
2012–2013Patents assigned to ENDISCH DENIS (2)· patent assignee history
2019–2021Patents assigned to APPLE INC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HONEYWELL INT INC | 9 | 2002–2013 |
| QUALCOMM MEMS TECHNOLOGIES INC | 6 | 2009–2015 |
| APPLE INC | 4 | 2019–2021 |
| ALLIED SIGNAL INC | 3 | 2000–2004 |
| ENDISCH DENISself | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cupertino, California, US | 23 | 2000–2021 |