LexDanaLexDanabeta
Inventor

Gaetan L. Mathieu

Inventor
Livermore, CA, US

Overview

175→
Patents
1991–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 175 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary
G01RMeasuring electric variables18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y10TTechnical subjects covered by former us classification12%
H05KPrinted circuits11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
B23KSoldering or unsoldering7%
H01RElectrically-conductive connections6%
Y02PClimate change mitigation technologies in the production or processing of goods6%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
C23CCoating metallic material3%
PatentTitleYear
10,800,652Exporting a selected group of micro-objects from a micro-fluidic device202010,690,628Pens for biological micro-objects202010,569,271Single-sided light-actuated microfluidic device with integrated mesh ground202010,252,907Exporting a selected group of micro-objects from a micro-fluidic device20199,857,333'Pens for biological micro-objects'20189,815,056'Single sided light-actuated microfluidic device with integrated mesh ground'20179,617,145'Exporting a selected group of micro-objects from a micro-fluidic device'20179,030,222'Sharpened, oriented contact tip structures'20158,513,942'Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby'20138,485,418'Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out'20138,476,538'Wiring substrate with customization layers'20138,427,183'Probe card assembly having an actuator for bending the probe substrate'20138,383,958'Method to build robust mechanical structures on substrate surfaces'20138,373,428'Probe card assembly and kit, and methods of making same'20138,354,855'Carbon nanotube columns and methods of making and using carbon nanotube columns as probes'20138,269,514'Method and apparatus for multilayer support substrate'20128,149,007'Carbon nanotube spring contact structures with mechanical and electrical components'20128,033,838'Microelectronic contact structure'20117,999,375'Electronic device with integrated micromechanical contacts and cooling system'20117,948,252'Multilayered probe card'20117,897,435'Re-assembly process for MEMS structures'20117,880,489'Printing of redistribution traces on electronic component'20117,868,632'Composite motion probing'20117,845,072'Method and apparatus for adjusting a multi-substrate probe structure'20107,841,863'Spring interconnect structures'20107,808,259'Component assembly and alignment'20107,798,822'Microelectronic contact structures'20107,737,709'Methods for planarizing a semiconductor contactor'20107,732,713'Method to build robust mechanical structures on substrate surfaces'20107,731,503'Carbon nanotube contact structures'20107,732,975'Biased gap-closing actuator'20107,731,546'Microelectronic contact structure'20107,729,878'Air bridge structures and methods of making and using air bridge structures'20107,714,598'Contact carriers (tiles) for populating larger substrates with spring contacts'20107,701,243'Electronic device testing using a probe tip having multiple contact features'20107,671,614'Apparatus and method for adjusting an orientation of probes'20107,658,831'Three dimensional microstructures and methods for making three dimensional microstructures'20107,659,736'Mechanically reconfigurable vertical tester interface for IC probing'20107,642,794'Method and system for compensating thermally induced motion of probe cards'20107,621,044'Method of manufacturing a resilient contact'20097,601,039'Microelectronic contact structure and method of making same'20097,592,821'Apparatus and method for managing thermally induced motion of a probe card assembly'20097,579,269'Microelectronic spring contact elements'20097,560,941'Method and system for compensating thermally induced motion of probe cards'20097,555,836'Method of making lithographic contact elements'20097,553,165'Spring interconnect structures'20097,550,842'Integrated circuit assembly'20097,488,917'Electric discharge machining of a probe array'20097,479,792'Methods for making plated through holes usable as interconnection wire or probe attachments'20097,471,094'Method and apparatus for adjusting a multi-substrate probe structure'20087,463,043'Methods of probing an electronic device'20087,458,816'Shaped spring'20087,444,253'Air bridge structures and methods of making and using air bridge structures'20087,435,108'Variable width resilient conductive contact structures'20087,400,157'Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes'20087,371,072'Spring interconnect structures'20087,347,702'Contact carriers (tiles) for populating larger substrates with spring contacts'20087,330,039'Method for making a socket to perform testing on integrated circuits'20087,325,302'Method of forming an interconnection element'20087,312,618'Method and system for compensating thermally induced motion of probe cards'20077,287,322'Lithographic contact elements'20077,285,968'Apparatus and method for managing thermally induced motion of a probe card assembly'20077,262,611'Apparatuses and methods for planarizing a semiconductor contactor'20077,251,884'Method to build robust mechanical structures on substrate surfaces'20077,230,437'Mechanically reconfigurable vertical tester interface for IC probing'20077,225,538'Resilient contact structures formed and then attached to a substrate'20077,218,127'Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component'20077,200,930'Probe for semiconductor devices'20077,202,682'Composite motion probing'20077,196,531'Method of manufacturing a probe card'20077,168,162'Method of manufacturing a probe card'20077,140,883'Contact carriers (tiles) for populating larger substrates with spring contacts'20067,142,000'Mounting spring elements on semiconductor devices, and wafer-level testing methodology'20067,127,811'Methods of fabricating and using shaped springs'20067,122,760'Using electric discharge machining to manufacture probes'20067,119,564'Method and system for compensating thermally induced motion of probe cards'20067,086,149'Method of making a contact structure with a distinctly formed tip structure'20067,084,656'Probe for semiconductor devices'20067,073,254'Method for mounting a plurality of spring contact elements'20067,071,714'Method and system for compensating for thermally induced motion of probe cards'20067,063,541'Composite microelectronic spring structure and method for making same'20067,059,047'Sockets for “springed” semiconductor devices'20067,047,638'Method of making microelectronic spring contact array'20067,048,548'Interconnect for microelectronic structures with enhanced spring characteristics'20067,024,763'Methods for making plated through holes usable as interconnection wire or probe attachments'20067,010,854'Re-assembly process for MEMS structures'20067,002,363'Method and system for compensating thermally induced motion of probe cards'20066,972,578'Method and system for compensating thermally induced motion of probe cards'20056,956,174'Tip structures'20056,945,827'Microelectronic contact structure'20056,937,037'Probe card assembly for contacting a device with raised contact elements'20056,920,689'Method for making a socket to perform testing on integrated circuits'20056,913,468'Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods'20056,888,229'Connection components with frangible leads and bus'20056,864,105'Method of manufacturing a probe card'20056,840,374'Apparatus and method for cleaning test probes'20056,836,962'Method and apparatus for shaping spring elements'20056,835,898'ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES'20046,827,584'Interconnect for microelectronic structures with enhanced spring characteristics'20046,825,422'Interconnection element with contact blade'20046,807,734'Microelectronic contact structures, and methods of making same'20046,791,176'Lithographic contact elements'20046,777,319'Microelectronic spring contact repair'20046,778,406'Resilient contact structures for interconnecting electronic devices'20046,741,085'Contact carriers (tiles) for populating larger substrates with spring contacts'20046,729,019'Method of manufacturing a probe card'20046,727,580'Microelectronic spring contact elements'20046,727,579'ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES'20046,713,374'Interconnect assemblies and methods'20046,701,612'Method and apparatus for shaping spring elements'20046,685,817'Method and apparatus for controlling plating over a face of a substrate'20046,672,875'Spring interconnect structures'20046,669,489'Interposer, socket and assembly for socketing an electronic component and method of making and using same'20036,664,628'Electronic component overlapping dice of unsingulated semiconductor wafer'20036,655,023'Method and apparatus for burning-in semiconductor devices in wafer form'20036,640,432'Method of fabricating shaped springs'20036,642,625'Sockets for springed semiconductor devices'20036,624,648'Probe card assembly'20036,616,966'Method of making lithographic contact springs'20036,615,485'Probe card assembly and kit, and methods of making same'20036,534,856'Sockets for springed semiconductor devices'20036,520,778'Microelectronic contact structures, and methods of making same'20036,509,751'Planarizer for a semiconductor contactor'20036,491,968'Methods for making spring interconnect structures'20026,482,013'Microelectronic spring contact element and electronic component having a plurality of spring contact elements'20026,483,328'Probe card for probing wafers with raised contact elements'20026,475,822'Method of making microelectronic contact structures'20026,476,333'Raised contact structures (solder columns)'20026,442,831'Method for shaping spring elements'20026,441,315'Contact structures with blades having a wiping motion'20026,336,269'Method of fabricating an interconnection element'20026,330,164'Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device'20016,307,161'Partially-overcoated elongate contact structures'20016,279,227'Method of forming a resilient contact structure'20016,274,823'Interconnection substrates with resilient contact structures on both sides'20016,268,015'Method of making and using lithographic contact springs'20016,255,126'Lithographic contact elements'20016,252,301'Compliant semiconductor chip assemblies and methods of making same'20016,246,247'Probe card assembly and kit, and methods of using same'20016,232,149'Sockets for \"springed\" semiconductor devices'20016,215,196'Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals'20016,184,053'Method of making microelectronic spring contact elements'20016,110,823'Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method'20006,090,261'Method and apparatus for controlling plating over a face of a substrate'20006,054,756'Connection components with frangible leads and bus'20006,050,829'Making discrete power connections to a space transformer of a probe card assembly'20006,043,563'Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals'20006,042,712'Apparatus for controlling plating over a face of a substrate'20006,032,356'Wafer-level test and burn-in, and semiconductor process'20006,033,935'Sockets for \"springed\" semiconductor devices'20006,029,344'Composite interconnection element for microelectronic components, and method of making same'20006,020,220'Compliant semiconductor chip assemblies and methods of making same'20005,998,228'Method of testing semiconductor'19995,994,152'Fabricating interconnects and tips using sacrificial substrates'19995,983,493'Method of temporarily, then permanently, connecting to a semiconductor device'19995,974,662'Method of planarizing tips of probe elements of a probe card assembly'19995,926,951'Method of stacking electronic components'19995,915,752'Method of making connections to a semiconductor chip assembly'19995,917,707'Flexible contact structure with an electrically conductive shell'19995,912,046'Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component'19995,897,326'Method of exercising semiconductor devices'19995,884,398'Mounting spring elements on semiconductor devices'19995,878,486'Method of burning-in semiconductor devices'19995,864,946'Method of making contact tip structures'19995,832,601'Method of making temporary connections between electronic components'19985,829,128'Method of mounting resilient contact structures to semiconductor devices'19985,806,181'Contact carriers (tiles) for populating larger substrates with spring contacts'19985,773,780'Method of severing bond wires and forming balls at their ends'19985,772,451'Sockets for electronic components and methods of connecting to electronic components'19985,601,740'Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires'19975,525,545'Semiconductor chip assemblies and components with pressure contact'19965,414,298'Semiconductor chip assemblies and components with pressure contact'19955,398,863'Shaped lead structure and method'19955,173,621'Transceiver with isolated power rails for ground bounce reduction'19925,065,224'Low noise integrated circuit and leadframe'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2005Patents assigned to TESSERA INC (8)· patent assignee history
1995–2006Based in Carmel, NY, US· patent location history
1997–2015Patents assigned to FORMFACTOR INC (152)· patent assignee history
1997–2011Based in Livermore, CA, US· patent location history
1998–2005Based in Dublin, CA, US· patent location history
2007–2020Based in Varennes, CA· patent location history
2009–2010Based in Vareness, CA· patent location history
2012–2015Patents assigned to MATHIEU GAETAN L (10)· patent assignee history
2013–2015Patents assigned to ELDRIDGE BENJAMIN N (8)· patent assignee history
2017–2020Patents assigned to BERKELEY LIGHTS INC (7)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FORMFACTOR INC1521997–2015
MATHIEU GAETAN Lself102012–2015
ELDRIDGE BENJAMIN N82013–2015
TESSERA INC81995–2005
BERKELEY LIGHTS INC72017–2020
Locations
LocationPatentsSpan
Livermore, California, US871997–2011
Varennes, CA382007–2020
Dublin, California, US211998–2005
Carmel, New York, US161995–2006
Vareness, CA72009–2010