Inventor
Kentaro Iizuka
Inventor
Tokyo, JP
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
B23KSoldering or unsoldering22%
H01LSemiconductor devices13%
Y10TTechnical subjects covered by former us classification9%
B24BMachines, devices, or processes for grinding or polishing7%
B28DWorking stone or stone-like materials4%
H10DInorganic electric semiconductor devices4%
B23BTurning2%
B24DTools for grinding, buffing or sharpening2%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
10,981,250Wafer producing apparatus202110,916,460Wafer producing apparatus202110,910,241Wafer producing apparatus and carrying tray202110,840,116Wafer producing apparatus202010,799,987Laser processing apparatus20209,381,577'Chuck table'20169,266,315'Separating apparatus'20167,863,160'Wafer processing method including forming blocking and dividing grooves'20117,799,700'Method for applying resin film to face of semiconductor wafer'20107,772,092'Wafer processing method'20107,649,157'Chuck table for use in a laser beam processing machine'20107,602,071'Apparatus for dividing an adhesive film mounted on a wafer'20097,329,564'Wafer dividing method'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2021Patents assigned to DISCO CORP (13)· patent assignee history
2008–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 13 | 2008–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 13 | 2008–2021 |