Inventor
PO-AN LIN
Inventor
TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Qprimary
H01QAntennas, i.e. radio aerials20%
B29CShaping or joining of plastics10%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts10%
B29LIndexing scheme associated with subclass b29c, relating to particular articles10%
G06FElectric digital data processing10%
H04BTransmission10%
H05KPrinted circuits10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
Y10TTechnical subjects covered by former us classification10%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to COMPAL ELECTRONICS INC (1)· patent assignee history
2022Patents assigned to HUANG HAN CHING (1)· patent assignee history
2022Patents assigned to LEE SHENG HUNG (1)· patent assignee history
2022–2026Based in TW· patent location history
2024–2026Patents assigned to ADVANCED SEMICONDUCTOR ENG (2)· patent assignee history
2026Patents assigned to APPLE INC (1)· patent assignee history
2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 2 | 2024–2026 |
| APPLE INC | 1 | 2026 |
| COMPAL ELECTRONICS INC | 1 | 2022 |
| HUANG HAN CHING | 1 | 2022 |
| LEE SHENG HUNG | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 3 | 2022–2026 |
| US | 1 | 2026 |