Inventor

Keisuke Kishimoto

Inventor
Yokohama, JP

Overview

20→
Patents
2012–2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Jprimary
B41JTypewriters48%
Y10TTechnical subjects covered by former us classification13%
B23KSoldering or unsoldering3%
B29CShaping or joining of plastics3%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts3%
B29LIndexing scheme associated with subclass b29c, relating to particular articles3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
B44CProducing decorative effects3%
C02FTreatment of water, waste water, sewage, or sludge3%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
PatentTitleYear
10,391,772Silicon substrate processing method and liquid ejection head manufacturing method201910,363,696Process for production of embossed films based on plasticized polyvinyl acetal20199,669,628'Liquid ejection head substrate, method of manufacturing the same, and method of processing silicon substrate'20179,333,749'Method for manufacturing liquid ejection head substrate'20168,993,357'Method for manufacturing liquid discharge head'20158,975,097'Method of manufacturing liquid discharge head'20158,951,815'Method for producing liquid-discharge-head substrate'20158,858,812'Processing method for an ink jet head substrate'20148,613,862'Method for manufacturing liquid discharge head substrate'20138,597,529'Method for processing substrate and method for producing liquid ejection head and substrate for liquid ejection head'20138,549,750'Method of manufacturing liquid discharge head substrate and method of processing the substrate'20138,492,281'Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrate'20138,435,805'Method of manufacturing a substrate for liquid ejection head'20138,429,820'Method of manufacturing liquid discharge head'20138,287,747'Method of processing silicon substrate and method of manufacturing substrate for liquid discharge head'20128,197,705'Method of processing silicon substrate and method of manufacturing liquid discharge head'20128,182,072'Substrate for inkjet printing head and method for manufacturing the substrate'20128,177,988'Method for manufacturing liquid discharge head'20128,114,305'Method of manufacturing substrate for liquid discharge head'20128,091,234'Manufacturing method for liquid discharge head substrate'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2019Patents assigned to CANON KK (19)· patent assignee history
2012–2015Patents assigned to KISHIMOTO KEISUKE (13)· patent assignee history
2012–2013Patents assigned to HATSUI TAKUYA (7)· patent assignee history
2012–2013Patents assigned to IBE SATOSHI (7)· patent assignee history
2012–2013Patents assigned to KOMIYAMA HIROTO (7)· patent assignee history
2012–2019Based in Yokohama, JP· patent location history
2012Based in Yokohoma, JP· patent location history
2019Based in Troisdorf, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CANON KK192012–2019
KISHIMOTO KEISUKEself132012–2015
HATSUI TAKUYA72012–2013
IBE SATOSHI72012–2013
KOMIYAMA HIROTO72012–2013
Locations
LocationPatentsSpan
Yokohama, JP182012–2019
Troisdorf, DE12019
Yokohoma, JP12012