Inventor
Stephen L. Buchwalter
Inventor
Hopewell Junction, NY, US
Overview
Patents· 79 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H05KPrinted circuits12%
Y10TTechnical subjects covered by former us classification12%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
B23KSoldering or unsoldering4%
C23CCoating metallic material4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B82YSpecific uses or applications of nanostructures3%
PatentTitleYear
11,110,534Continuous solder transfer to substrates202110,833,120Injection molded microoptics202010,490,594Injection molded microoptics20199,490,408'Injection molded microoptics'20168,963,020'Process for making stubless printed circuit boards'20158,541,299'Electrical interconnect forming method'20138,476,773'Electrical interconnect structure'20138,404,981'Process for making stubless printed circuit boards'20138,376,207'Micro-fluidic injection molded solder (IMS)'20138,314,500'Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers'20128,268,719'Sprocket opening alignment process and apparatus for multilayer solder decal'20128,242,010'Electrical interconnect forming method'20128,227,264'Reworkable electronic device assembly and method'20128,162,200'Micro-fluidic injection molded solder (IMS)'20128,136,714'Micro-fluidic injection molded solder (IMS)'20127,980,446'Micro-fluidic injection molded solder (IMS)'20117,936,060'Reworkable electronic device assembly and method'20117,932,169'Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers'20117,928,585'Sprocket opening alignment process and apparatus for multilayer solder decal'20117,838,954'Semiconductor structure with solder bumps'20107,815,968'Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation'20107,786,001'Electrical interconnect structure and method'20107,776,993'Underfilling with acid-cleavable acetal and ketal epoxy oligomers'20107,523,852'Solder interconnect structure and method using injection molded solder'20097,516,879'Method of producing coaxial solder bump connections using injection molding of solder'20097,452,568'Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation'20087,404,251'Manufacture of printed circuit boards with stubless plated through-holes'20087,399,421'Injection molded microoptics'20087,064,013'Cap attach surface modification for improved adhesion'20066,924,171'Bilayer wafer-level underfill'20056,919,420'Acid-cleavable acetal and ketal based epoxy oligomers'20056,890,599'Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays'20056,879,098'Display fabrication using modular active devices'20056,803,256'Cap attach surface modification for improved adhesion'20046,777,817'Reworkable and thermally conductive adhesive and use thereof'20046,698,077'Display fabrication using modular active devices'20046,632,536'Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays'20036,617,698'Reworkable and thermally conductive adhesive and use thereof'20036,531,343'Method of encapsulating a circuit assembly'20036,369,452'Cap attach surface modification for improved adhesion'20026,326,237'Reworkable thermoplastic hyper-branched encapsulant'20016,258,899'Cleavable acetal-containing diepoxide and anhydride curing agent for removable epoxy compositions'20016,177,975'Precision alignment of plates'20016,111,323'Reworkable thermoplastic encapsulant'20006,104,466'Precision alignment of plates'20005,998,876'Reworkable thermoplastic hyper-branched encapsulant'19995,932,682'Cleavable diepoxide for removable epoxy compositions'19995,930,597'Reworkable polymer chip encapsulant'19995,891,526'Apparatus for mixing a multi-component encapsulant and injecting it through a heated nozzle onto a part to be encapsulated'19995,879,859'Strippable photoimageable compositions'19995,858,943'Gel for localized removal of reworkable encapsulant'19995,786,986'Multi-level circuit card structure'19985,776,370'Charge transfer complexes between polyaniline and organic electron acceptors and method of fabrication'19985,759,285'Method and solution for cleaning solder connections of electronic components'19985,659,203'Reworkable polymer chip encapsulant'19975,563,273'Covalent compound having a radical-cationic moiety covalently linked to a radical anionicmoiety'19965,560,934'Cleavable diepoxide for removable epoxy compositions'19965,512,613'Cleavable diepoxide for removable epoxy compositions'19965,462,628'Method for bonding two surfaces together'19955,357,005'Reactive surface functionalization'19945,340,451'Process for producing a metal organic polymer combination'19945,281,447'Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes'19945,242,713'Method for conditioning an organic polymeric material'19935,203,955'Method for etching an organic polymeric material'19935,187,241'Isoimide modifications of a polyimide and reaction thereof with nucleophiles'19935,179,467'Charge transfer salts and uses thereof'19935,135,779'Method for conditioning an organic polymeric material'19925,133,840'Surface midification of a polyimide'19924,832,808'Polyimides reaction products and use in electrophoretic deposition'19894,414,068'Self-curable resinous compositions useful in coating applications'1983RE031022'Michael adducts of polymeric materials useful in coating applications'19824,341,676'Self-curable resinous compositions containing N-methylol amide groups useful in coating applications'19824,330,640'Novel acrylic polymers and the Michael adducts thereof useful in coating applications'19824,316,784'Process for electrodeposition of Michael adducts of polymeric materials'19824,256,560'Curable resinous compositions useful in coating applications'19814,248,753'Michael adducts of polymeric materials useful in coating applications'19814,198,331'Resinous coating compositions curable by Michael adduct exchange'19804,141,810'Cationic electrodeposition using aqueous dispersions of quaternary ammonium carbonate-containing polymers'19794,102,863'Cationic electrodeposition using aqueous dispersions of quaternary ammonium carbonate-containing polymers'1978Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1978–1983Patents assigned to PPG INDUSTRIES INC (9)· patent assignee history
1978–1983Based in Allison Park, PA, US· patent location history
1989–2021Patents assigned to IBM (65)· patent assignee history
1989–1998Based in Wappingers Falls, NY, US· patent location history
1994–2019Based in Hopewell Junction, NY, US· patent location history
2011–2021Based in Anthem, AZ, US· patent location history
2012–2013Patents assigned to BUCHWALTER STEPHEN L (7)· patent assignee history
2012–2013Patents assigned to GRUBER PETER A (7)· patent assignee history
2012–2013Patents assigned to NAH JAE-WOONG (7)· patent assignee history
2012Based in Armonk, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 65 | 1989–2021 |
| PPG INDUSTRIES INC | 9 | 1978–1983 |
| BUCHWALTER STEPHEN Lself | 7 | 2012–2013 |
| GRUBER PETER A | 7 | 2012–2013 |
| NAH JAE-WOONG | 7 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 49 | 1994–2019 |
| Wappingers Falls, New York, US | 12 | 1989–1998 |
| Allison Park, Pennsylvania, US | 10 | 1978–1983 |
| Anthem, AZ, US | 7 | 2011–2021 |
| Armonk, New York, US | 1 | 2012 |