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Inventor

Tung-Chin Yeh

Inventor
Toufen Township, TW

Overview

3→
Patents
2016–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10DInorganic electric semiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
10,014,252Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitors20189,711,474'Semiconductor package structure with polymeric layer and manufacturing method thereof'20179,385,079'Methods for forming stacked capacitors with fuse protection'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
2016–2018Based in Toufen Township, TW· patent location history
2017–2018Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2017Based in Miao-Li County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22017–2018
TAIWAN SEMICONDUCTOR MFG12016
Locations
LocationPatentsSpan
Toufen Township, TW22016–2018
Miao-Li County, TW12017