Inventor
Awnish GUPTA
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H01LSemiconductor devices18%
H01JElectric discharge tubes or discharge lamps14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
H05HPlasma technique4%
H10BElectronic memory devices4%
H10KOrganic electric solid-state devices4%
PatentTitleYear
12,598,930Conformal thermal CVD with controlled film properties and high deposition rate202612,431,349In-situ control of film properties during atomic layer deposition202512,417,943Reducing intralevel capacitance in semiconductor devices202512,412,742Impurity reduction in silicon-containing films202512,288,685Modifying hydrophobicity of a wafer surface using an organosilicon precursor202512,157,945Thermal atomic layer deposition of silicon-containing films202412,037,686Selective carbon deposition2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to LAM RES CORP (6)· patent assignee history
2024–2026Based in US· patent location history
2026Patents assigned to LAM RES CORPORATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 6 | 2024–2025 |
| LAM RES CORPORATION | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2024–2026 |