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Inventor

Mark Pavier

Inventor
Felbridge, GB

Overview

46→
Patents
2003–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 46 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1054%
H01LSemiconductor devices18%
H10DInorganic electric semiconductor devices11%
H05KPrinted circuits4%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for2%
H03KPulse technique2%
B23KSoldering or unsoldering1%
H01FMagnets1%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems1%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters1%
PatentTitleYear
10,283,432Molded package with chip carrier comprising brazed electrically conductive layers201910,103,076Semiconductor package including a semiconductor die having redistributed pads201810,074,590Molded package with chip carrier comprising brazed electrically conductive layers20189,673,109'Method for fabricating a semiconductor package with conductive carrier integrated heat spreader'20179,633,951'Semiconductor package including a semiconductor die having redistributed pads'20179,576,887'Semiconductor package including conductive carrier coupled power switches'20179,502,395'Power semiconductor package having vertically stacked driver IC'20169,397,212'Power converter package including top-drain configured power FET'20169,362,221'Surface mountable power components'20169,299,690'Method for fabricating a power semiconductor package including vertically stacked driver IC'20169,269,655'Method for fabricating a semiconductor package with conductive carrier integrated heat spreader'20169,159,703'Power converter package including vertically stacked driver IC'20159,111,921'Semiconductor package with conductive carrier integrated heat spreader'20159,012,990'Surface mountable power components'20158,836,145'Power semiconductor device with reduced contact resistance'20148,552,543'Semiconductor package'20138,466,546'Chip-scale package'20138,390,131'Semiconductor device with reduced contact resistance'20138,143,729'Autoclave capable chip-scale package'20128,089,147'IMS formed as can for semiconductor housing'20128,026,580'Semiconductor device package with integrated heat spreader'20117,923,289'Process for fabricating a semiconductor package'2011RE041719'Power MOSFET with integrated drivers in a common package'20107,745,930'Semiconductor device packages with substrates for redistributing semiconductor device electrodes'20107,678,680'Semiconductor device with reduced contact resistance'20107,678,609'Semiconductor package with redistributed pads'20107,671,455'Semiconductor device package with integrated heat spreader'20107,547,964'Device packages having a III-nitride based power semiconductor device'20097,402,507'Semiconductor package fabrication'20087,382,051'Semiconductor device with reduced contact resistance'20087,365,423'Redistributed solder pads using etched lead frame'20087,345,563'Embedded inductor for semiconductor device circuit'20087,274,100'Battery protection circuit with integrated passive components'20077,250,672'Dual semiconductor die package with reverse lead form'20077,235,877'Redistributed solder pads using etched lead frame'20077,227,198'Half-bridge package'20077,095,099'Low profile package having multiple die'20067,034,344'Integrated semiconductor power device for multiple battery systems'20066,924,175'Clip-type lead frame for source mounted die'20056,894,397'Plural semiconductor devices in monolithic flip chip'20056,891,739'H-bridge with power switches and control in a single package'20056,858,922'Back-to-back connected power semiconductor device package'20056,838,735'Trench FET with non overlapping poly and remote contact therefor'20056,723,620'Power semiconductor die attach process using conductive adhesive film'20046,717,260'Clip-type lead frame for source mounted die'20046,593,622'Power mosfet with integrated drivers in a common package'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2016Patents assigned to INT RECTIFIER CORP (38)· patent assignee history
2003–2005Based in Guildford, GB· patent location history
2006–2013Based in West Sussex, GB· patent location history
2007–2017Based in Felbridge, GB· patent location history
2012–2017Patents assigned to PAVIER MARK (6)· patent assignee history
2013–2017Patents assigned to SAWLE ANDREW N (2)· patent assignee history
2016–2018Patents assigned to INFINEON TECHNOLOGIES AMERICAS CORP (9)· patent assignee history
2018–2019Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
2018–2019Based in Felbrigde, GB· patent location history
2018Based in Fellbridge, GB· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INT RECTIFIER CORP382003–2016
INFINEON TECHNOLOGIES AMERICAS CORP92016–2018
PAVIER MARKself62012–2017
INFINEON TECHNOLOGIES AG22018–2019
SAWLE ANDREW N22013–2017
Locations
LocationPatentsSpan
Felbridge, GB272007–2017
West Sussex, GB72006–2013
Guildford, GB72003–2005
Felbrigde, GB22018–2019
Fellbridge, GB12018