Inventor
Michael K. Truscott
Inventor
Chippewa Falls, WI, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics57%
B29LIndexing scheme associated with subclass b29c, relating to particular articles18%
B23PMetal-working not otherwise provided for7%
LOC297%
B05DProcesses for applying fluent materials to surfaces, in general4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
D0930150Patient interface2021D0924388Patient interface202111,045,991Dual stage flex lip for an extrusion die202110,974,432Extrusion system including an edge encapsulation block202110,821,643System and method for adjusting the land channel length on an extrusion die202010,773,440Extrusion die having adjustable end seal system and method of use202010,442,126Coextrusion feedblock201910,252,457Flow diverter valve for an extrusion system201910,220,561Extrusion device and method of use20199,931,779Extrusion die having adjustable end seal system and method of use20189,925,709'Extrusion die tension adjuster and method of using same'20189,815,237'System for adjusting the land channel length on an extrusion die'20179,808,980'Coextrusion feedblock, coextrusion profiling insert assembly, and methods of operation'20179,694,530'Extrusion die tension adjuster and method of using same'20179,327,441'Adjustable feedblock'20169,216,534'Coextrusion feedblock and coextrusion profiling insert assembly'20159,149,967'Extrusion dies with internal and/or external deckles'20159,108,218'System and method for making multilayer films and a layer multiplication device'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2021Patents assigned to NORDSON CORP (16)· patent assignee history
2015Patents assigned to NORDSON EXTRUSION DIES IND LLC (3)· patent assignee history
2015–2021Based in Chippewa Falls, WI, US· patent location history
2021Patents assigned to ResMed Asia Pte Ltd (1)· patent assignee history
2021Patents assigned to ResMed Pty Ltd (1)· patent assignee history
2021Based in Sydney, AU· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NORDSON CORP | 16 | 2015–2021 |
| NORDSON EXTRUSION DIES IND LLC | 3 | 2015 |
| ResMed Asia Pte Ltd | 1 | 2021 |
| ResMed Pty Ltd | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chippewa Falls, WI, US | 16 | 2015–2021 |
| Sydney, AU | 2 | 2021 |