Inventor

Isamu Nishimura

Inventor

Kyoto, JP

Overview

2001–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 35 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H01LSemiconductor devices21%

H10DInorganic electric semiconductor devices12%

H05KPrinted circuits5%

H10HInorganic light-emitting semiconductor devices having potential barriers5%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

B41JTypewriters4%

H10NElectric solid-state devices not otherwise provided for4%

G01RMeasuring electric variables2%

H01FMagnets2%

PatentTitleYear

11,011,297Semiconductor device and semiconductor module2021 10,985,083Semiconductor device and method for manufacturing the same2021 10,930,574Semiconductor device and method for manufacturing the same2021 10,651,374Semiconductor device, and method for manufacturing the same2020 10,470,310Electronic component and a method for manufacturing an electronic component2019 10,410,944Semiconductor device2019 10,347,550Semiconductor package and method of making the same2019 10,279,597Thermal print head2019 10,141,500Magnetoelectric converting element and module utilizing the same2018 10,115,651Electronic component having a chip mounted on a substrate with a sealing resin and manufacturing method thereof2018 10,070,530Electronic component and manufacturing method thereof2018 9,983,272Magnetism detection device2018 9,937,729Thermal print head2018 9,899,360'Semiconductor device'2018 9,796,189'Thermal print head'2017 9,704,840'Optical semiconductor device'2017 9,697,948'Semiconductor device and semiconductor module'2017 9,698,092'Electronic device'2017 9,673,144'Semiconductor device with metal think film and via'2017 9,660,150'Semiconductor light-emitting device'2017 9,627,344'Semiconductor device'2017 9,585,254'Electronic device'2017 9,257,387'Semiconductor device and method of manufacturing the same'2016 9,136,216'Semiconductor device and method of manufacturing the same'2015 8,237,221'Semiconductor device and method of manufacturing semiconductor device'2012 8,044,491'Semiconductor device and method of manufacturing the same'2011 8,022,472'Semiconductor device and method of manufacturing semiconductor device'2011 7,994,585'Semiconductor device and method for manufacturing the same'2011 7,781,863'Semiconductor device and method of manufacturing the same'2010 7,071,529'Semiconductor device having a Damascene gate or a replacing gate'2006 6,869,829'Semiconductor chip, chip-on-chip structure device, and assembling method thereof'2005 6,476,499'Semiconductor chip, chip-on-chip structure device and assembling method thereof'2002 6,404,061'Semiconductor device and semiconductor chip'2002 6,335,206'Integrated capacitor device and method of fabricating the same'2002 6,251,797'Method of fabricating semiconductor device'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2021Patents assigned to ROHM CO LTD (33)· patent assignee history

2001–2021Based in Kyoto, JP· patent location history

2002Patents assigned to ROHM CO (1)· patent assignee history

2006Patents assigned to SANYO ELECTRIC CO (1)· patent assignee history

2006Based in Shizuoka, JP· patent location history

2012Patents assigned to NISHIMURA ISAMU (1)· patent assignee history

2012Patents assigned to YAGI RYOTARO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ROHM CO LTD	33	2001–2021
NISHIMURA ISAMUself	1	2012
ROHM CO	1	2002
SANYO ELECTRIC CO	1	2006
YAGI RYOTARO	1	2012

Locations

Location	Patents	Span
Kyoto, JP	34	2001–2021
Shizuoka, JP	1	2006