LexDanaLexDanabeta
Inventor

Yumiko Ohno

Inventor
Atsugi, JP

Overview

90→
Patents
1996–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 90 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H10DInorganic electric semiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10KOrganic electric solid-state devices11%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H01LSemiconductor devices4%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
G06KGraphical data reading2%
PatentTitleYear
10,727,437Semiconductor device and method for manufacturing the same202010,709,224Device control system, wearable device, information processing device, fragrance material ejection method, and device control method202010,634,944Method of manufacturing optical film202010,186,682Semiconductor device and method for manufacturing the same201910,038,012Semiconductor device and manufacturing method thereof, delamination method, and transferring method201810,032,671Manufacturing method of semiconductor device using peeling20189,927,653'Method of manufacturing optical film'20189,929,190'Semiconductor device and manufacturing method thereof'20189,640,778'Semiconductor device and method for manufacturing the same'20179,543,337'Semiconductor device and manufacturing method thereof, delamination method, and transferring method'20179,508,620'Semiconductor device and manufacturing method thereof'20169,429,800'Semiconductor device'20169,299,879'Peeling method and method for manufacturing display device using the peeling method'20169,269,817'Semiconductor device and manufacturing method thereof, delamination method, and transferring method'20169,263,617'Semiconductor device and manufacturing method thereof'20169,224,667'Semiconductor device and manufacturing method thereof'20159,178,182'Semiconductor device and method for manufacturing the same'20159,093,324'Semiconductor apparatus and fabrication method of the same'20159,013,650'Peeling method and method for manufacturing display device using the peeling method'20158,945,331'Method of transferring a laminate and method of manufacturing a semiconductor device'20158,830,413'Peeling method and method for manufacturing display device using the peeling method'20148,691,604'Semiconductor device and manufacturing method thereof, delamination method, and transferring method'20148,674,493'IC card and booking-account system using the IC card'20148,634,041'Liquid crystal display device and manufacturing method of liquid crystal display device'20148,525,171'Semiconductor apparatus and fabrication method of the same'20138,508,682'Peeling method and method for manufacturing display device using the peeling method'20138,482,011'Light-emitting device'20138,441,102'Semiconductor device having a capacitor'20138,415,679'Semiconductor device and manufacturing method thereof'20138,384,699'Semiconductor device'20138,268,702'IC card and booking-account system using the IC card'20128,247,246'Semiconductor device and manufacturing method thereof, delamination method, and transferring method'20128,237,176'Light emitting device'20128,237,164'Semiconductor device including magnet'20128,228,454'Peeling method and method for manufacturing display device using the peeling method'20128,218,105'Liquid crystal display device and manufacturing method of liquid crystal display device'20128,212,364'Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance'20128,193,532'Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container'20128,173,520'Semiconductor device and manufacturing method thereof'20128,158,491'IC card and booking-account system using the IC card'20128,134,153'Semiconductor apparatus and fabrication method of the same'20128,044,946'Semiconductor device'20118,044,397'Semiconductor device having light emitting element, integrated circuit and adhesive layer'20118,044,411'Light emitting device'20118,040,456'Liquid crystal display device and manufacturing method of liquid crystal display device'20118,026,152'Separation method of semiconductor device'20118,013,335'Semiconductor apparatus and fabrication method of the same'20118,012,854'Semiconductor device and manufacturing method thereof'20117,973,313'Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container'20117,923,348'Semiconductor device and manufacturing method thereof'20117,863,754'Semiconductor device and manufacturing method thereof'20117,863,116'IC card and booking-account system using the IC card'20117,746,333'Semiconductor device'20107,741,642'Semiconductor device and manufacturing method thereof'20107,732,262'Semiconductor device and method of manufacturing the same'20107,723,209'Semiconductor device and manufacturing method thereof, delamination method, and transferring method'20107,714,950'Peeling method and method for manufacturing display device using the peeling method'20107,666,719'Peeling method'20107,652,359'Article having display device'20107,622,797'Semiconductor device having a flexible printed circuit'20097,576,362'Semiconductor device having EL element, integrated circuit and adhesive layer therebetween'20097,569,859'Manufacturing method of light emitting device and manufacturing device thereof'20097,564,139'Semiconductor device and method for manufacturing the same'20097,547,612'Semiconductor device and manufacturing method thereof'20097,541,228'Semiconductor device, method of manufacturing the same, and method of designing the same'20097,518,692'IC card and booking account system using the IC card'20097,511,380'Semiconductor chip and method manufacturing the same'20097,495,256'Semiconductor apparatus and fabrication method of the same'20097,459,726'Semiconductor device comprising a light emitting element and a light receiving element'20087,436,050'Semiconductor device having a flexible printed circuit'20087,407,870'Method for manufacturing semiconductor device'20087,375,006'Peeling method'20087,344,925'Semiconductor device, method of manufacturing the same, and method of designing the same'20087,303,942'Semiconductor device and method for manufacturing the same'20077,245,331'Peeling method and method for manufacturing display device using the peeling method'20077,230,316'Semiconductor device having transferred integrated circuit'20077,189,631'Semiconductor device and manufacturing method thereof'20077,180,093'Semiconductor device and manufacturing method thereof'20077,169,636'Manufacturing method of light emitting device and manufacturing device thereof'20077,164,151'Semiconductor device with pixel portion and driving circuit, and electronic device'20077,147,740'Method of transferring a laminate and method of manufacturing a semiconductor device'20067,122,445'Peeling method'20067,091,070'Semiconductor device and method of manufacturing the same'20067,067,926'Semiconductor chip and method for manufacturing the same'20067,067,392'Semiconductor apparatus and fabrication method of the same'20067,056,810'Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance'20067,045,442'Method of separating a release layer from a substrate comprising hydrogen diffusion'20067,037,752'Semiconductor device and manufacturing method thereof'20066,875,998'Semiconductor device, method of manufacturing the same, and method of designing the same'20055,487,903'Method for improving the qualities of meat and meat piece treated thereby'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996Based in Ibaraki, JP· patent location history
2005–2020Patents assigned to SEMICONDUCTOR ENERGY LAB (88)· patent assignee history
2005–2018Based in Atsugi, JP· patent location history
2006–2020Based in Kanagawa, JP· patent location history
2012–2016Patents assigned to MARUYAMA JUNYA (23)· patent assignee history
2012–2016Patents assigned to OHNO YUMIKO (23)· patent assignee history
2012–2016Patents assigned to TAKAYAMA TORU (23)· patent assignee history
2012–2016Patents assigned to YAMAZAKI SHUNPEI (15)· patent assignee history
2013Based in Kangawa, JP· patent location history
2020Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEMICONDUCTOR ENERGY LAB882005–2020
MARUYAMA JUNYA232012–2016
OHNO YUMIKOself232012–2016
TAKAYAMA TORU232012–2016
YAMAZAKI SHUNPEI152012–2016
Locations
LocationPatentsSpan
Atsugi, JP592005–2018
Kanagawa, JP282006–2020
Osaka, JP12020
Kangawa, JP12013
Ibaraki, JP11996