Inventor

Robert T. Matthews

Inventor
Plano, TX, US

Overview

32→
Patents
1987–1997
Patent span
Electricity
Primary field (CPC H)

Patents· 32 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1037%
C23CCoating metallic material21%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests16%
H01JElectric discharge tubes or discharge lamps11%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
H05HPlasma technique4%
C03BManufacture, shaping, or supplementary processes2%
C23FNon-mechanical removal of metallic material from surface2%
C30BSingle-crystal growth2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
5,653,838'Glass heating and sealing system'19975,591,493'Structure and method for incorporating an inductively coupled plasma source in a plasma processing chamber'19975,580,385'Structure and method for incorporating an inductively coupled plasma source in a plasma processing chamber'19965,464,499'Multi-electrode plasma processing apparatus'19955,453,124'Programmable multizone gas injector for single-wafer semiconductor processing equipment'19955,446,825'High performance multi-zone illuminator module for semiconductor wafer processing'19955,367,606'Multi-zone illuminator with embedded process control sensors'19945,345,534'Semiconductor wafer heater with infrared lamp module with light blocking means'19945,286,297'Multi-electrode plasma processing apparatus'19945,268,989'Multi zone illuminator with embeded process control sensors and light interference elimination circuit'19935,248,636'Processing method using both a remotely generated plasma and an in-situ plasma with UV irradiation'19935,138,973'Wafer processing apparatus having independently controllable energy sources'19925,044,871'Integrated circuit processing system'19914,966,519'Integrated circuit processing system'19904,949,671'Processing apparatus and method'19904,943,457'Vacuum slice carrier'19904,911,103'Processing apparatus and method'19904,886,570'Processing apparatus and method'19894,875,989'Wafer processing apparatus'19894,872,938'Processing apparatus'19894,842,686'Wafer processing apparatus and method'19894,836,905'Processing apparatus'19894,832,777'Processing apparatus and method'19894,832,778'Processing apparatus for wafers'19894,832,779'Processing apparatus'19894,830,700'Processing apparatus and method'19894,822,450'Processing apparatus and method'19894,820,377'Method for cleanup processing chamber and vacuum process module'19894,818,327'Wafer processing apparatus'19894,816,116'Semiconductor wafer transfer method and arm mechanism'19894,816,098'Apparatus for transferring workpieces'19894,687,542'Vacuum processing system'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–1997Patents assigned to TEXAS INSTRUMENTS INC (32)· patent assignee history
1987–1997Based in Plano, TX, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TEXAS INSTRUMENTS INC321987–1997
Locations
LocationPatentsSpan
Plano, Texas, US321987–1997