LexDanaLexDanabeta
Inventor

Vincent Tan

Inventor
Singapore, SG

Overview

4→
Patents
2019–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Rprimary
H01RElectrically-conductive connections40%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
LOC1320%
PatentTitleYear
10,957,997High density connector assembly202110,931,055Multifunction connector2021D0907578Connector body202110,325,826Substrate with reservoir for die attach adhesive2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to NXP USA INC (1)· patent assignee history
2019Based in Kuala Lumpur, MY· patent location history
2021Patents assigned to 3M INNOVATIVE PROPERTIES CO (3)· patent assignee history
2021Based in Singapore, SG· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
3M INNOVATIVE PROPERTIES CO32021
NXP USA INC12019
Locations
LocationPatentsSpan
Singapore, SG32021
Kuala Lumpur, MY12019