Inventor
Kok Yau Chua
Inventor
Melaka, MY
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
B81BMicrostructural devices or systems, e.g. micromechanical devices16%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems16%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers8%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
C23CCoating metallic material5%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
11,081,417Manufacturing a package using plateable encapsulant202110,777,536Semiconductor package with air cavity202010,631,100Micro-electrical mechanical system sensor package and method of manufacture thereof202010,595,132Micro-electrical mechanical system sensor package and method of manufacture thereof202010,501,312Over-under sensor packaging with sensor spaced apart from control chip201910,396,007Semiconductor package with plateable encapsulant and a method for manufacturing the same201910,304,780Device having substrate with conductive pillars201910,163,812Device having substrate with conductive pillars201810,155,657Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening20189,868,632'Molded cavity package with embedded conductive layer and enhanced sealing'20189,475,691'Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to INFINEON TECHNOLOGIES AG (10)· patent assignee history
2016–2020Based in Melaka, MY· patent location history
2021Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 10 | 2016–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 10 | 2016–2020 |
| Taichung, TW | 1 | 2021 |