Inventor
Roden R. Topacio
Inventor
Markham, CA
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1054%
H01LSemiconductor devices18%
H05KPrinted circuits13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y10TTechnical subjects covered by former us classification3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
G06FElectric digital data processing2%
H10DInorganic electric semiconductor devices2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
10,431,533Circuit board with constrained solder interconnect pads201910,403,589Interconnect etch with polymer layer edge protection20199,728,518'Interconnect etch with polymer layer edge protection'20179,576,923'Semiconductor chip with patterned underbump metallization and polymer film'20179,318,457'Methods of fabricating semiconductor chip solder structures'20169,209,106'Thermal management circuit board for stacked semiconductor chip device'20159,142,520'Methods of fabricating semiconductor chip solder structures'20159,059,159'Routing layer for mitigating stress in a semiconductor die'20159,035,471'Routing layer for mitigating stress in a semiconductor die'20158,927,344'Die substrate with reinforcement structure'20158,847,383'Integrated circuit package strip with stiffener'20148,772,083'Solder mask with anchor structures'20148,664,777'Routing layer for mitigating stress in a semiconductor die'20148,647,974'Method of fabricating a semiconductor chip with supportive terminal pad'20148,642,463'Routing layer for mitigating stress in a semiconductor die'20148,637,983'Face-to-face (F2F) hybrid structure for an integrated circuit'20148,633,599'Semiconductor chip with underfill anchors'20148,389,340'Methods of forming semiconductor chip underfill anchors'20138,378,471'Semiconductor chip bump connection apparatus and method'20138,313,984'Die substrate with reinforcement structure'20128,299,632'Routing layer for mitigating stress in a semiconductor die'20128,298,945'Method of manufacturing substrates having asymmetric buildup layers'20128,294,266'Conductor bump method and apparatus'20128,227,926'Routing layer for mitigating stress in a semiconductor die'20128,120,170'Integrated package circuit with stiffener'20128,058,108'Methods of forming semiconductor chip underfill anchors'20117,994,044'Semiconductor chip with contoured solder structure opening'20117,985,621'Method and apparatus for making semiconductor packages'20117,973,408'Semiconductor chip passivation structures and methods of making the same'20117,906,424'Conductor bump method and apparatus'20117,888,259'Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same'20117,790,501'Semiconductor chip passivation structures and methods of making the same'20107,670,939'Semiconductor chip bump connection apparatus and method'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2019Patents assigned to ATI TECHNOLOGIES ULC (31)· patent assignee history
2010–2017Based in Markham, CA· patent location history
2011–2019Patents assigned to TOPACIO RODEN R (14)· patent assignee history
2011–2016Patents assigned to ADVANCED MICRO DEVICES INC (8)· patent assignee history
2011–2016Patents assigned to MCLELLAN NEIL (7)· patent assignee history
2012–2019Patents assigned to TOPACIO RODEN (9)· patent assignee history
2015Based in Ontario, CA· patent location history
2019Based in Springwater, CA· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ATI TECHNOLOGIES ULC | 31 | 2010–2019 |
| TOPACIO RODEN Rself | 14 | 2011–2019 |
| TOPACIO RODENself | 9 | 2012–2019 |
| ADVANCED MICRO DEVICES INC | 8 | 2011–2016 |
| MCLELLAN NEIL | 7 | 2011–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Markham, CA | 30 | 2010–2017 |
| Springwater, CA | 2 | 2019 |
| Ontario, CA | 1 | 2015 |