Inventor

CHEN-HUA YU

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 635 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H01LSemiconductor devices30%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

G02BOptical elements, systems or apparatus4%

H10DInorganic electric semiconductor devices4%

H05KPrinted circuits2%

H01QAntennas, i.e. radio aerials1%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%

H10BElectronic memory devices1%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%

PatentTitleYear

12,598,757Structure and formation method of package with hybrid interconnection2026 12,599,009Package structure2026 12,593,632Method of implanting semiconductor donor substrate and method of manufacturing semiconductor-on-insulator structure2026 12,588,523InFO-POP structures with TIVs having cavities2026 12,588,222Semiconductor package including an integrated circuit die and an inductor or a transformer2026 12,581,977Bonding through multi-shot laser reflow2026 12,568,849Dam for three-dimensional integrated circuit2026 12,560,829Photonic semiconductor device and method2026 12,564,057Chiplet interposer2026 12,554,083Optical devices and methods of manufacture2026 12,557,690Package structures2026 12,554,064Photonic assembly for enhanced bonding yield and methods for forming the same2026 12,557,661Package structure with antenna element2026 12,554,080Optical connection structures for a photonic assembly and methods for forming the same2026 12,554,062Package devices and methods of manufacture2026 12,546,935Integrated circuit package and method of forming same2026 12,550,793Integrated circuit package and method2026 12,550,734Integrated circuit package and method2026 12,541,058Nested waveguide fan-out structure and methods for forming the same2026 12,543,569Package with improved heat dissipation efficiency and method for forming the same2026 12,538,851Memory packages and methods of forming same2026 12,532,725Package structure2026 12,532,755Semiconductor device and method of manufacturing2026 12,517,301Photon source and optical computing architecture2026 12,517,298Integrated 3DIC with stacked photonic dies and method forming same2026 12,512,424Package, package structure and method of manufacturing the same2025 12,504,588Semiconductor device and methods of manufacture2025 12,506,115—2025 12,504,654Photonic semiconductor-insulator-semiconductor modulator and methods for forming the same2025 12,500,124Method of singulating a semiconductor device2025 12,500,139Package with heat dissipation structure and method for forming the same2025 12,494,455Multi-die package structures including an interconnected package component disposed in a substrate cavity2025 12,489,062Semiconductor package and manufacturing method thereof2025 12,489,089Chip package structure with conductive shielding film2025 12,484,323Stacked image sensor device and method of forming same2025 12,482,790Packages with stacked dies and methods of forming the same2025 12,477,847Method of manufacturing semiconductor devices with system on chip devices2025 12,476,135Semiconductor package and method2025 12,469,756Warpage control of packages using embedded core frame2025 12,469,808Semiconductor package and manufacturing method thereof2025 12,469,718Dense redistribution layers in semiconductor packages and methods of forming the same2025 12,469,763Package with improved heat dissipation efficiency and method for forming the same2025 12,463,175Bonding with pre-deoxide process and apparatus for performing the same2025 12,455,420Photonic semiconductor device and method of manufacture2025 12,451,426Conductive traces in semiconductor devices and methods of forming same2025 12,451,366Semiconductor package and method of forming thereof2025 12,444,665Semiconductor device2025 12,442,978Photonic package and method of manufacture2025 12,438,082Package structures and method of forming the same2025 12,438,120Chip package structure with redistribution layer having bonding portion2025 12,431,366Structure having thermal dissipation structure therein and manufacturing method thereof2025 12,424,587Semiconductor device having underfill surrounding bottom package and solder ball2025 12,424,576Integrated circuit package and method2025 12,422,635Thermo-electric cooler for dissipating heat of optical engine2025 12,417,991Chip stack structure with conductive plug and method for forming the same2025 12,418,0013D integrated circuit (3DIC) structure2025 12,416,862Apparatus, system and method2025 12,412,882Buffer design for package integration2025 12,412,799Integrated circuit package and method2025 12,412,817Integrated circuit package and method2025 12,412,852Polymer layers embedded with metal pads for heat dissipation2025 12,411,279Integrated circuit package and method of forming same2025 12,401,012Semiconductor device package and methods of manufacture2025 12,394,758Packages with metal line crack prevention design2025 12,394,732Semiconductor package and method2025 12,394,736Semiconductor package system and method2025 12,394,242Fingerprint sensor device and method2025 12,392,961Structure and process for photonic packages2025 12,394,684Die stacking structure, semiconductor package and formation method of the die stacking structure2025 12,388,060Integrated fan-out packages and methods of forming the same2025 12,381,176Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer2025 12,374,651Wafer bonding method2025 12,368,141IPD modules with flexible connection scheme in packaging2025 12,368,077Semiconductor package and method comprising formation of redistribution structure and interconnecting die2025 12,368,280Semiconductor device and method2025 12,368,146Hybrid integrated circuit packages2025 12,368,149Methods of forming semiconductor packages2025 12,362,315Heterogeneous dielectric bonding scheme2025 12,362,228Semiconductor package and method2025 12,362,262Semiconductor device including through die via2025 12,353,134Photoresist system and method2025 12,354,926Package and method for manufacturing the same2025 12,354,969Semiconductor device and method of manufacture2025 12,353,011Photonic package and method of manufacture2025 12,356,558Electronic assembly having circuit carrier2025 12,347,785Semiconductor structure and method manufacturing the same2025 12,345,935Package assembly and manufacturing method thereof2025 12,347,791Integrated circuit package and method2025 12,341,106Package structure2025 12,341,079Package structure and manufacturing method thereof2025 12,334,446Semiconductor package and method2025 12,334,362Package structure including photonic package having embedded optical glue2025 12,327,796Architecture for computing system package2025 12,327,819Devices employing thermal and mechanical enhanced layers and methods of forming same2025 12,322,705Chip package and manufacturing method thereof2025 12,315,831Package structure and manufacturing method thereof2025 12,315,784Semiconductor package and manufacturing method thereof2025 12,315,819Method of forming RDLs and structure formed thereof2025 12,315,854Integrated circuit package and method2025 12,306,036Optical devices and methods of manufacture2025 12,308,343Semiconductor device and method of forming the same2025 12,300,575Semiconductor package and method2025 12,300,571Integrated circuit package and method2025 12,302,677Semiconductor device and method2025 12,300,656Semiconductor package and method of forming thereof2025 12,300,646Chiplets 2025 12,300,659Aligning bumps in fan-out packaging process2025 12,294,002Integrated circuit package and method of forming same2025 12,293,991Semiconductor packages and methods of forming same2025 12,283,556Package structure2025 12,283,492Photonic integrated package and method forming same2025 12,276,838Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures2025 12,278,214Integrated circuit package and method2025 12,272,637Integrated fan-out package with 3D magnetic core inductor2025 12,272,616Heat-dissipating structures for semiconductor devices and methods of manufacture2025 12,272,631Semiconductor package having multiple substrates2025 12,266,612Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features2025 12,265,330Polymer material in a redistribution structure of a semiconductor package and method of manufacture2025 12,266,619Integrated devices in semiconductor packages and methods of forming same2025 12,261,142Semiconductor structure including thermal enhanced bonding structure2025 12,260,669Fingerprint sensor in InFO structure and formation method2025 12,259,578Photonic semiconductor device and method of manufacture2025 12,255,174Bonding passive devices on active dies to form 3D packages2025 12,255,079Semiconductor package and method of manufacturing the same2025 12,255,184Semiconductor packages and methods of forming the same2025 12,253,729Optical transceiver and manufacturing method thereof2025 12,249,581Method of manufacture overlay mark using laser marking process for semiconductor device2025 12,249,587Semiconductor structure and forming method thereof2025 12,249,518Semiconductor device comprising interconnect structures2025 12,243,681Programmable inductor and methods of manufacture2025 12,242,108Photonic semiconductor device and method of manufacture2025 12,243,829Semiconductor package including cavity-mounted device2025 12,242,197Apparatus, system and method2025 12,243,843Integrated circuit package and method of forming same2025 12,237,238Package structure and method2025 12,238,865Integrated circuit structure2025 12,228,776Package with integrated optical die and method forming same2025 12,230,513Cross-wafer RDLs in constructed wafers2025 12,224,247Fan-out package having a main die and a dummy die2025 12,222,545Package and method of forming same2025 12,224,2763D semiconductor packages2025 12,218,093Semiconductor die connection system and method2025 12,217,976Method of fabricating package2025 12,218,022Passivation structure with planar top surfaces2025 12,218,020Semiconductor packages2025 12,218,089Packaged semiconductor device and method of forming thereof2025 12,218,026Package structure for heat dissipation2025 12,218,006System, device and methods of manufacture2025 12,218,009Semiconductor package and methods of forming the same2025 12,210,188Semiconductor package and manufacturing method thereof2025 12,211,801Chip package and method of forming the same2025 12,211,779Semiconductor package having multiple substrates2025 12,209,015MEMS packages and methods of manufacture thereof2025 12,210,200Photonic semiconductor device and method of manufacture2025 12,205,860Sensor packages2025 12,205,923Semiconductor device, circuit board structure and manufacturing method thereof2025 12,205,879Symmetrical substrate for semiconductor packaging2025 12,199,080Electronics card including multi-chip module2025 12,199,051Integrated circuit structure and method2025 12,199,024Semiconductor device and method of manufacture2025 12,199,065Multi-die package structures including redistribution layers2025 12,191,270Integrated circuit package and method of forming same2025 12,193,168Circuit board and semiconductor device including the same2025 12,191,251Semiconductor device and method of manufacture2025 12,191,224Semiconductor package and manufacturing method thereof2025 12,191,279Integrated circuit packages and methods of forming the same2025 12,183,700Semiconductor device package and method of manufacture2024 12,174,415Semiconductor package and manufacturing method thereof2024 12,176,282Manufacturing method of semiconductor package2024 12,170,267Semiconductor device and method of manufacture2024 12,165,985Semiconductor device and method2024 12,165,941Semiconductor device and method of manufacture2024 12,164,158Package having prism structure and manufacturing method thereof2024 12,159,860Singulation and bonding methods and structures formed thereby2024 12,159,822Method of manufacturing a semiconductor package having conductive pillars2024 12,159,851Package structure having hollow cylinders and method of fabricating the same2024 12,148,651Chuck design and method for wafer2024 12,147,159Semiconductor device and method of manufacture2024 12,142,597Integrated fan-out package and the methods of manufacturing2024 12,142,524Via for component electrode connection2024 12,135,454Structure and process for photonic packages2024 12,136,612Three-dimension large system integration2024 12,136,593Electronic apparatus including antennas and directors2024 12,125,812Integrated circuit packages and methods of forming the same2024 12,125,794Semiconductor device and manufacturing method of semiconductor device2024 12,125,798Semiconductor package and method2024 12,119,292Semiconductor device and method of manufacture2024 12,119,303Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof2024 12,113,005Packages with Si-substrate-free interposer and method forming same2024 12,105,323Semiconductor package2024 12,107,051Method of forming semiconductor packages having through package vias2024 12,100,698Semiconductor device and manufacturing method thereof2024 12,100,672Semiconductor device and method of manufacture2024 12,094,728Semiconductor device2024 12,092,861Photonic semiconductor device and method of manufacture2024 12,094,860Package structure and manufacturing method thereof2024 12,087,757Integrated circuit packages2024 12,087,732Isolation bonding film for semiconductor packages and methods of forming the same2024 12,080,684Die stacks and methods forming same2024 12,080,615Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors2024 12,080,563Semiconductor devices and methods of manufacturing2024 12,074,122Inductor structure, semiconductor package and fabrication method thereof2024 12,074,140System formed through package-in-package formation2024 12,074,143Integrated circuit package and method2024 12,074,064TSV structure and method forming same2024 12,074,127Semiconductor die contact structure and method2024 12,068,295Deep partition power delivery with deep trench capacitor2024 12,068,297Hybrid integrated circuit package2024 12,062,603Semiconductor device having via sidewall adhesion with encapsulant2024 12,062,640Semiconductor device and manufacturing method thereof2024 12,058,101Package structure and method of forming the same2024 12,057,406Package having redistribution layer structure with protective layer2024 12,057,359Semiconductor package and method of fabricating the same2024 12,057,405Packages with thick RDLs and thin RDLs stacked alternatingly2024 12,057,438Die stack structure and manufacturing method thereof2024 12,057,410Semiconductor device and method of manufacture2024 12,057,407Semiconductor package and method2024 12,051,652Package structure and method of fabricating the same2024 12,051,650Semiconductor package and method2024 12,051,616Wafer level chip scale packaging intermediate structure apparatus and method2024 12,051,649Architecture for computing system package2024 12,044,892Package structure including photonic package and interposer having waveguide2024 12,038,599Photonic package and method of manufacture2024 12,040,281Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof2024 12,040,566Antenna device2024 12,040,309Bonding through multi-shot laser reflow2024 12,033,976Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package2024 12,033,963Package structure comprising thermally conductive layer around the IC die2024 12,027,446Method for forming a semiconductor component with a cooling structure2024 12,021,047Semiconductor packages having a die, an encapsulant, and a redistribution structure2024 12,020,983Processes for reducing leakage and improving adhesion2024 12,020,997Methods of forming semiconductor device packages having alignment marks on a carrier substrate2024 12,020,953Fan-out structure and method of fabricating the same2024 12,021,053Semiconductor package and method2024 12,021,008Thermal interface materials, 3D semiconductor packages and methods of manufacture2024 12,015,023Integrated circuit package and method of forming same2024 12,014,976Chip package structure including a silicon substrate interposer and methods for forming the same2024 12,015,008Wafer bonding method2024 12,014,993Package having redistribution layer structure with protective layer and method of fabricating the same2024 12,009,575Package structure2024 12,009,335Structure and method of forming a joint assembly2024 12,002,799Die stacking structure and method forming same2024 12,002,761Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device2024 11,996,383Bonded semiconductor devices and methods of forming the same2024 11,996,227Hexagonal semiconductor package structure2024 11,996,371Chiplet interposer2024 11,990,381Integrated circuit packages having support rings2024 11,984,374Warpage control of packages using embedded core frame2024 11,984,405Pad structure design in fan-out package2024 11,978,691Semiconductor device and manufacturing method thereof2024 11,973,074Photonic semiconductor device and method of manufacture2024 11,967,546Giga interposer integration through Chip-On-Wafer-On-Substrate2024 11,967,563Fan-out package having a main die and a dummy die2024 11,967,553Semiconductor package and manufacturing method of the same2024 11,961,811Semiconductor structures and method of manufacturing the same2024 11,961,789Semiconductor package and manufacturing method thereof2024 11,961,814Integrated circuit package and method2024 11,961,800Via for semiconductor device connection and methods of forming the same2024 11,953,740Package structure2024 11,955,442Semiconductor package and method2024 11,955,349Anisotropic carrier for high aspect ratio fanout2024 11,955,378Bonding method of package components and bonding apparatus2024 11,955,405Semiconductor package including thermal interface structures and methods of forming the same2024 11,948,862Package structures and method of forming the same2024 11,948,930Semiconductor package and method of manufacturing the same2024 11,947,173Photonic semiconductor device and method of manufacture2024 11,948,926Integrated circuit package and method2024 11,942,464Semiconductor package and method2024 11,942,433Integrated circuit package and method2024 11,935,760Package structure having thermal dissipation structure therein and manufacturing method thereof2024 11,935,761Semiconductor package and method of forming thereof2024 11,935,802Integrated circuit package and method of forming same2024 11,929,261Semiconductor package and method of manufacturing the same2024 11,929,345Semiconductor device including binding agent adhering an integrated circuit device to an interposer2024 11,923,349Semiconductor structures2024 11,923,315Semiconductor package and manufacturing method thereof2024 11,923,207Redistribution structures for semiconductor packages and methods of forming the same2024 11,916,028Package structure and method of forming the same2024 11,908,706Cross-wafer RDLs in constructed wafers2024 11,908,795Package structures and method of forming the same2024 11,901,196Method for forming photonic integrated package2024 11,901,319Semiconductor package system and method2024 11,901,302InFO-POP structures with TIVs having cavities2024 11,894,299Conductive traces in semiconductor devices and methods of forming same2024 11,894,309System on integrated chips (SoIC) and semiconductor structures with integrated SoIC2024 11,894,318Semiconductor device and method of manufacture2024 11,868,047Polymer layer in semiconductor device and method of manufacture2024 11,869,869Heterogeneous dielectric bonding scheme2024 11,862,606Packages with metal line crack prevention design2024 11,862,605Integrated circuit package and method of forming same2024 11,855,047Chip package structure with conductive shielding film2023 11,855,246Semiconductor device and method2023 11,854,988Semiconductor device and method of manufacture2023 11,855,021Semiconductor structure with through substrate vias and manufacturing method thereof2023 11,856,800Semiconductor devices with system on chip devices2023 11,854,998Semiconductor device and method of manufacture2023 11,854,990Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die2023 11,854,992Semiconductor structure and manufacturing method thereof2023 11,855,016Semiconductor device and method of manufacture2023 11,854,994Redistribution structure for integrated circuit package and method of forming same2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (626)· patent assignee history

2021–2026Based in TW· patent location history

2022Patents assigned to TAIWAN UNION TECHNOLOGY CORP (2)· patent assignee history

2022Patents assigned to BOMBARDIER INC (1)· patent assignee history

2022Based in CA· patent location history

2025Patents assigned to PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC (4)· patent assignee history

2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	626	2021–2026
PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC	4	2025
TAIWAN SEMICONDUCTOR MFG COMPANY LTD	2	2026
TAIWAN UNION TECHNOLOGY CORP	2	2022
BOMBARDIER INC	1	2022

Locations

Location	Patents	Span
TW	634	2021–2026
CA	1	2022