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Inventor

TAKAHISA HASEGAWA

Inventor
JP

Overview

2→
Patents
2022
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
B22FWorking metallic powder13%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering13%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants13%
G05BControl or regulating systems in general13%
H01HElectric switches13%
Y02PClimate change mitigation technologies in the production or processing of goods13%
PatentTitleYear
11,527,374Touch sensing system202211,420,260Method of manufacturing fabricated object2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to FANUC CORP (1)· patent assignee history
2022Patents assigned to MITSUBISHI HEAVY IND LTD (1)· patent assignee history
2022Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FANUC CORP12022
MITSUBISHI HEAVY IND LTD12022
Locations
LocationPatentsSpan
JP22022