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Inventor

Douglas Kelly

Inventor
Boise, ID, US

Overview

3→
Patents
1991–2004
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
6,680,213'Method and system for fabricating contacts on semiconductor components'20046,600,171'Semiconductor component and system for fabricating contacts on semiconductor components'20035,021,864'Die-mounting paddle for mechanical stress reduction in plastic IC packages'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2004Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
1991–2004Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC31991–2004
Locations
LocationPatentsSpan
Boise, ID, US31991–2004