Inventor

Jen-Yi Chen

Inventor

Taichung, TW

Overview

25→

Patents

2011–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Rprimary

H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers27%

B81BMicrostructural devices or systems, e.g. micromechanical devices21%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

H01LSemiconductor devices6%

G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure5%

G01CMeasuring distances, levels or bearings3%

H10NElectric solid-state devices not otherwise provided for3%

Y10TTechnical subjects covered by former us classification3%

C23CCoating metallic material2%

PatentTitleYear

10,710,868MEMS sensor2020 10,638,235MEMS speaker2020 10,609,491Speaker and MEMs actuator thereof2020 10,536,780Piezoelectric transducer2020 10,072,999Air pressure sensing system2018 9,729,990'Manufacturing method of a condenser microphone'2017 9,656,853'MEMS chip package'2017 9,382,112'Manufacturing methods for micro-electromechanical system device having electrical insulating structure'2016 9,369,808'Acoustic transducer with high sensitivity'2016 9,319,764'MEMS microphone packaging structure'2016 9,319,772'Multi-floor type MEMS microphone'2016 9,258,662'Condenser microphone and manufacturing method thereof'2016 9,193,581'MEMS microphone package structure having an improved carrier and a method of manufacturing same'2015 9,162,869'MEMS microphone package structure having non-planar substrate and method of manufacturing same'2015 9,036,838'Dual-diaphragm acoustic transducer'2015 8,900,886'System and method of monitoring and controlling atomic layer deposition of tungsten'2014 8,695,426'Micro-electromechanical system device having electrical insulating structure and manufacturing methods'2014 8,586,486'Method for forming semiconductor device'2013 8,468,665'Methods for making capacitive microphone'2013 8,144,899'Acoustic transducer and microphone using the same'2012 8,039,910'Electro-acoustic sensing device'2011 8,035,402'Sensor'2011 7,960,805'MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall'2011 7,912,235'Capacitive microphone and method for making the same'2011 7,902,843'Sensor'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2016Patents assigned to IND TECH RES INST (9)· patent assignee history

2011–2016Based in Hsinchu County, TW· patent location history

2011–2018Based in Hsinchu, TW· patent location history

2012–2014Patents assigned to CHEN JEN-YI (4)· patent assignee history

2013–2014Patents assigned to CHEN KUN-EI (2)· patent assignee history

2013–2014Patents assigned to CHIANG CHEN-CHIEH (2)· patent assignee history

2013–2014Based in Yunlin County, TW· patent location history

2015–2020Patents assigned to MERRY ELECTRONICS SHENZHEN CO LTD (9)· patent assignee history

2015–2020Based in Taichung, TW· patent location history

2016–2017Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IND TECH RES INST	9	2011–2016
MERRY ELECTRONICS SHENZHEN CO LTD	9	2015–2020
CHEN JEN-YIself	4	2012–2014
CHEN KUN-EI	2	2013–2014
CHIANG CHEN-CHIEH	2	2013–2014

Locations

Location	Patents	Span
Taichung, TW	11	2015–2020
Hsinchu County, TW	6	2011–2016
Hsinchu, TW	3	2011–2018
Taipei, TW	2	2016–2017
Yunlin County, TW	2	2013–2014