Inventor

Jong Tae Moon

Inventor
Daejeon, KR

Overview

24→
Patents
1998–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
G02BOptical elements, systems or apparatus11%
H05KPrinted circuits9%
Y10TTechnical subjects covered by former us classification9%
B23KSoldering or unsoldering6%
B82YSpecific uses or applications of nanostructures6%
H01LSemiconductor devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein3%
H01FMagnets3%
PatentTitleYear
11,094,908Lighting apparatus using organic light emitting diode20219,980,393Pattern-forming method for forming a conductive circuit pattern20189,462,736'Composition and methods of forming solder bump and flip chip using the same'20169,293,689'Method of manufacturing a piezoelectric micro energy harvester'20169,155,236'Composition and methods of forming solder bump and flip chip using the same'20158,802,760'Composition and methods of forming solder bump and flip chip using the same'20148,723,292'Silicon interposer including backside inductor'20148,598,768'Piezoelectric micro energy harvester and manufacturing method thereof'20138,524,571'Vacuum wafer level packaging method for micro electro mechanical system device'20138,420,722'Composition and methods of forming solder bump and flip chip using the same'20138,211,745'Method and structure for bonding flip chip'20128,044,757'Electronic device including LTCC inductor'20118,030,200'Method for fabricating a semiconductor package'20117,985,697'Wafer level package and method of fabricating the same'20117,733,207'Vertically formed inductor and electronic device having the same'20107,553,092'Optical module and optical module package'20097,520,682'Transceiver module and optical bench for passive alignment'20097,298,933'Optical module'20077,012,939'Wavelength stabilization module having light-receiving element array and method of manufacturing the same'20067,009,716'System for monitoring optical output/wavelength'20066,825,065'Method for optical module packaging of flip chip bonding'20046,707,161'Optical module package of flip chip bonding'20046,297,543'Chip scale package'20015,854,867'Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2016Patents assigned to KOREA ELECTRONICS TELECOMM (20)· patent assignee history
1998–2021Based in Seoul, KR· patent location history
2006Based in Jeollabuk-do, KR· patent location history
2007–2018Based in Daejeon, KR· patent location history
2011–2013Based in Chungcheongnam-do, KR· patent location history
2012–2014Patents assigned to MOON JONG TAE (5)· patent assignee history
2012–2013Patents assigned to EOM YONG SUNG (3)· patent assignee history
2012–2014Patents assigned to CHOI KWANG-SEONG (2)· patent assignee history
2013–2014Patents assigned to BAE HYUN-CHEOL (2)· patent assignee history
2014–2016Based in Gyeryong-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KOREA ELECTRONICS TELECOMM201998–2016
MOON JONG TAEself52012–2014
EOM YONG SUNG32012–2013
BAE HYUN-CHEOL22013–2014
CHOI KWANG-SEONG22012–2014
Locations
LocationPatentsSpan
Daejeon, KR82007–2018
Seoul, KR41998–2021
Gyeryong-si, KR42014–2016
Chungcheongnam-do, KR22011–2013
Jeollabuk-do, KR22006