Inventor
John C. Fernandez
Inventor
Boise, ID, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
Y10TTechnical subjects covered by former us classification30%
H01LSemiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
9,064,973'Die attached to a support member by a plurality of adhesive members'20158,278,751'Methods of adhering microfeature workpieces, including a chip, to a support member'20127,518,237'Microfeature systems including adhered microfeature workpieces and support members'20096,303,985'Semiconductor lead frame and package with stiffened mounting paddle'20016,023,666'In-line method of monitoring die attach material adhesive weight'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2015Patents assigned to MICRON TECHNOLOGY INC (5)· patent assignee history
2000–2015Based in Boise, ID, US· patent location history
2012–2015Patents assigned to CLYNE CRAIG T (2)· patent assignee history
2012–2015Patents assigned to FERNANDEZ JOHN C (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 5 | 2000–2015 |
| CLYNE CRAIG T | 2 | 2012–2015 |
| FERNANDEZ JOHN Cself | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 5 | 2000–2015 |