Inventor

Shuhei Takahashi

Inventor
Kiyosu, JP

Overview

29→
Patents
2008–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H01LSemiconductor devices15%
C09KMaterials for miscellaneous applications, not provided for elsewhere12%
C09GPolishing compositions11%
B24BMachines, devices, or processes for grinding or polishing9%
H10DInorganic electric semiconductor devices8%
G03GElectrography4%
A61KPreparations for medical, dental or toiletry purposes3%
H05BElectric heating3%
H10KOrganic electric solid-state devices3%
PatentTitleYear
10,770,284Substrate processing method and substrate processing apparatus202010,759,981Polishing method and polishing composition202010,485,737Dental curable composition having high mechanical strength201910,429,761Image forming apparatus using ultraviolet and infrared radiation201910,372,053Recorded material and image forming method201910,256,163Method of treating a microelectronic substrate using dilute TMAH201910,227,517Polishing method and polishing composition201910,190,024Polishing composition201910,037,901Substrate liquid treatment apparatus, method of cleaning substrate liquid treatment apparatus and non-transitory storage medium20189,946,204Image forming apparatus, control method, and storage medium20189,855,195'Dental curable composition'20189,804,539'Image forming apparatus and image forming method'20179,685,341'Abrasive composition and method for producing semiconductor substrate'20179,579,769'Composition for polishing purposes, polishing method using same, and method for producing substrate'20179,505,950'Polishing composition and method for producing substrate'20169,427,379'Dental material set and a dental membrane for obscuring a metal color of a dental metal, and a preparing method thereof'20169,206,336'Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate'20159,090,799'Composition for polishing and method of polishing semiconductor substrate using same'20159,036,211'Light emitting apparatus, manufacturing method for the light emitting apparatus, printer, and manufacturing method for the printer'20159,028,709'Surface treatment composition and surface treatment method using same'20158,980,733'Semiconductor device and manufacturing method thereof'20158,974,691'Composition for polishing and composition for rinsing'20158,929,243'Network monitoring device'20158,901,809'Light emitting device and manufacturing method thereof'20148,632,693'Wetting agent for semiconductors, and polishing composition and polishing method employing it'20148,038,496'Method of manufacturing a light emitting device and using an electrode layer as a mask during manufacturing'20117,821,002'Semiconductor device and manufacturing method thereof'20107,748,908'Bearing device'20107,423,373'Light emitting device and manufacturing method thereof'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2015Patents assigned to SEMICONDUCTOR ENERGY LAB (5)· patent assignee history
2008–2014Based in Atsugi, JP· patent location history
2010–2019Based in Aichi, JP· patent location history
2014–2020Patents assigned to FUJIMI INC (11)· patent assignee history
2014–2015Patents assigned to TAKAHASHI SHUHEI (6)· patent assignee history
2014–2020Based in Kiyosu, JP· patent location history
2015–2019Patents assigned to CANON KK (5)· patent assignee history
2015–2019Based in Chiba, JP· patent location history
2016–2019Patents assigned to SHOFU KK (3)· patent assignee history
2016–2019Based in Kyoto, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJIMI INC112014–2020
TAKAHASHI SHUHEIself62014–2015
CANON KK52015–2019
SEMICONDUCTOR ENERGY LAB52008–2015
SHOFU KK32016–2019
Locations
LocationPatentsSpan
Kiyosu, JP102014–2020
Chiba, JP42015–2019
Kyoto, JP32016–2019
Aichi, JP32010–2019
Atsugi, JP32008–2014