Inventor

Young Gwan Ko

Inventor

Suwon-si, KR

Overview

2002–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 68 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

H01LSemiconductor devices26%

H05KPrinted circuits21%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%

Y10TTechnical subjects covered by former us classification4%

H01FMagnets1%

B01JChemical or physical processes, e.g. catalysis or colloid chemistry1%

C01BNon-metallic elements1%

C01GCompounds containing metals not covered by subclasses c01d or c01f1%

C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds1%

PatentTitleYear

10,879,189Semiconductor device and method for manufacturing the same2020 10,825,775Semiconductor package integrating active and passive components with electromagnetic shielding2020 10,818,604Semiconductor package2020 10,811,328Semiconductor package2020 10,796,997Semiconductor package2020 10,790,224Carrier substrate and method of manufacturing semiconductor package using the same2020 10,770,418Fan-out semiconductor package2020 10,727,212Semiconductor package2020 10,665,535Semiconductor package2020 10,573,613Fan-out semiconductor package2020 10,541,221Fan-out semiconductor package2020 10,522,497Fan-out semiconductor package2019 10,522,451Fan-out semiconductor package2019 10,475,748Fan-out semiconductor package2019 10,475,776Fan-out semiconductor package module2019 10,455,708Multilayered substrate and method for manufacturing the same2019 10,446,478Semiconductor package2019 10,438,884Carrier substrate and method of manufacturing semiconductor package using the same2019 10,410,961Fan-out semiconductor package2019 10,403,579Semiconductor device and method for manufacturing the same2019 10,388,614Fan-out semiconductor package and method of manufacturing same2019 10,373,884Fan-out semiconductor package for packaging semiconductor chip and capacitors2019 10,362,667Circuit board and manufacturing method thereof2019 10,347,556Passivation layer having opening for under bump metallurgy2019 10,306,778Printed circuit board with dam around cavity and manufacturing method thereof2019 10,262,949Fan-out semiconductor package and method of manufacturing the same2019 10,256,200Electronic component package and method of manufacturing the same2019 10,211,136Fan-out semiconductor package2019 10,212,803Circuit board and circuit board assembly2019 10,199,337Electronic component package and method of manufacturing the same2019 10,170,386Electronic component package and method of manufacturing the same2019 10,115,648Fan-out semiconductor package and electronic device including the same2018 10,109,588Electronic component package and package-on-package structure including the same2018 10,102,964Coil electronic component and manufacturing method thereof2018 10,062,652Fan-out semiconductor package and method of manufacturing same2018 10,064,291Circuit board and manufacturing method thereof2018 10,045,444Printed circuit board, package and method of manufacturing the same2018 10,032,697Electronic component package and electronic device including the same2018 10,026,668Passivation layer having an opening for under bump metallurgy2018 10,021,785Printed circuit board and method of manufacturing the same2018 10,015,877Circuit board comprising heat transfer structure2018 10,002,811Electronic component package and method of manufacturing the same2018 9,999,131Printed circuit board with embedded electronic component and manufacturing method thereof2018 9,992,865Circuit board and assembly thereof2018 9,984,979Fan-out semiconductor package and method of manufacturing the same2018 9,966,178Chip electronic component and manufacturing method thereof2018 9,848,492Printed circuit board and method of manufacturing the same2017 9,842,789'Electronic component package and method of manufacturing the same'2017 9,837,343Chip embedded substrate2017 9,832,866Multilayered substrate and method of manufacturing the same2017 9,832,856Circuit board2017 9,793,250'Package board, method for manufacturing the same and package on package having the same'2017 9,741,630'Electronic component package and method of manufacturing the same'2017 9,736,927'Printed circuit board and method of manufacturing the same'2017 9,736,939'Printed circuit board and method of manufacturing printed circuit board'2017 9,699,885'Circuit board including heat dissipation structure'2017 9,655,229'Circuit board'2017 9,578,749'Element embedded printed circuit board and method of manufacturing the same'2017 9,554,466'Printed circuit board and method of manufacturing the same'2017 8,883,647'Method of manufacturing of trench substrate'2014 8,729,406'Method of fabricating a printed circuit board'2014 8,604,345'Printed circuit board having plating pattern buried in via'2013 8,410,373'Printed circuit substrate and method of manufacturing the same'2013 8,234,781'Printed circuit board and method of fabricating the same'2012 8,215,011'Method of manufacturing a printed circuit board'2012 8,196,293'Method of manufacturing a printed circuit board'2012 8,072,052'Trench substrate'2011 6,468,498'Composite metal material, preparation thereof and photocatalytic process using same'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2019Based in Seoul, KR· patent location history

2011–2020Patents assigned to SAMSUNG ELECTRO MECH (47)· patent assignee history

2011–2014Patents assigned to KO YOUNG GWAN (8)· patent assignee history

2011–2014Patents assigned to LEE SANG SOO (2)· patent assignee history

2012–2013Patents assigned to AHN SEOK HWAN (2)· patent assignee history

2012–2014Based in Kyungki-do, KR· patent location history

2017–2020Based in Suwon-si, KR· patent location history

2019–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (20)· patent assignee history

2019Based in Hwaseong-si, KR· patent location history

2020Based in Gyeonggi-do, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SAMSUNG ELECTRO MECH	47	2011–2020
SAMSUNG ELECTRONICS CO LTD	20	2019–2020
KO YOUNG GWANself	8	2011–2014
AHN SEOK HWAN	2	2012–2013
LEE SANG SOO	2	2011–2014

Locations

Location	Patents	Span
Suwon-si, KR	38	2017–2020
Seoul, KR	25	2002–2019
Kyungki-do, KR	3	2012–2014
Gyeonggi-do, KR	1	2020
Hwaseong-si, KR	1	2019