Inventor
Kensaku Morii
Inventor
Takatsuki, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
4,868,638'Plastic molded pin grid chip carrier package'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989Patents assigned to MATSUSHITA ELECTRIC WORKS LTD (1)· patent assignee history
1989Based in Takatsuki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC WORKS LTD | 1 | 1989 |
Locations
| Location | Patents | Span |
|---|---|---|
| Takatsuki, JP | 1 | 1989 |