Inventor
Donald Ferrier
Inventor
Thomaston, CT, US
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits34%
C23CCoating metallic material28%
C23FNon-mechanical removal of metallic material from surface9%
B23KSoldering or unsoldering6%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
C09JAdhesives4%
B05DProcesses for applying fluent materials to surfaces, in general3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
RE045881'Method for enhancing the solderability of a surface'2016RE045842'Method for enhancing the solderability of a surface'2016RE045297'Method for enhancing the solderability of a surface'20147,186,305'Process for improving the adhesion of polymeric materials to metal surfaces'20076,554,948'Process for improving the adhesion of polymeric materials to metal surfaces'20036,503,566'Process for improving the adhesion of polymeric materials to metal surfaces'20036,419,784'Process for improving the adhesion of polymeric materials to metal surfaces'20026,383,272'Process for improving the adhesion of polymeric materials to metal surfaces'20026,162,503'Process for improving the adhesion of polymeric materials to metal surfaces'20006,146,701'Process for improving the adhension of polymeric materials to metal surfaces'20006,020,029'Process for treating metal surfaces'20005,935,640'Method for enhancing the solderability of a surface'19995,869,130'Process for improving the adhesion of polymeric materials to metal surfaces'19995,843,517'Composition and method for selective plating'19985,759,378'Process for preparing a non-conductive substrate for electroplating'19985,733,599'Method for enhancing the solderability of a surface'19985,632,927'Process for preparing a non-conductive substrate for electroplating'19975,536,386'Process for preparing a non-conductive substrate for electroplating'19965,518,760'Composition and method for selective plating'19965,468,515'Composition and method for selective plating'19955,334,240'Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base'19945,289,630'Process for fabricating multilayer printed circuits'19945,261,154'Process for fabricating multilayer printed circuits'19935,104,688'Pretreatment composition and process for tin-lead immersion plating'19924,976,990'Process for metallizing non-conductive substrates'19904,897,118'Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein'19904,831,210'Shields for electromagnetic radiation'19894,782,007'Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists'19884,761,303'Process for preparing multilayer printed circuit boards'19884,748,104'Selective metallization process and additive method for manufactured printed circuit boards'19884,325,990'Electroless copper deposition solutions with hypophosphite reducing agent'19824,279,948'Electroless copper deposition solution using a hypophosphite reducing agent'19814,209,331'Electroless copper composition solution using a hypophosphite reducing agent'1980Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1980–2000Patents assigned to MACDERMID INC (25)· patent assignee history
1980–2016Based in Thomaston, CT, US· patent location history
2007–2016Patents assigned to FERRIER DONALD (4)· patent assignee history
2014–2016Patents assigned to KUKANSKIS PETER (3)· patent assignee history
2014–2016Patents assigned to REDLINE RONALD (3)· patent assignee history
2014–2016Patents assigned to SAWOSKA DAVID (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MACDERMID INC | 25 | 1980–2000 |
| FERRIER DONALDself | 4 | 2007–2016 |
| KUKANSKIS PETER | 3 | 2014–2016 |
| REDLINE RONALD | 3 | 2014–2016 |
| SAWOSKA DAVID | 3 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Thomaston, CT, US | 33 | 1980–2016 |