LexDanaLexDanabeta
Inventor

PHILIP DAMBERG

Inventor
US

Overview

3→
Patents
2021–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices25%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification25%
PatentTitleYear
12,211,821Package-on-package assembly with wire bond vias202511,735,563Package-on-package assembly with wire bond vias202311,189,595Package-on-package assembly with wire bond vias2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to INVENSAS CORP (1)· patent assignee history
2021–2025Based in US· patent location history
2023Patents assigned to INVENSAS LLC (1)· patent assignee history
2025Patents assigned to ADEIA SEMICONDUCTOR TECH LLC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADEIA SEMICONDUCTOR TECH LLC12025
INVENSAS CORP12021
INVENSAS LLC12023
Locations
LocationPatentsSpan
US32021–2025