Inventor
Yong-Chai Kwon
Inventor
Suwon-si, KR
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation17%
H04NPictorial communication, e.g. television14%
A47GHousehold or table equipment7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
E05YIndexing scheme associated with subclasses e05d and e05f, relating to construction elements, electric control, power supply, power signal or transmission, user interfaces, mounting or coupling, details, accessories, auxiliary operations not otherwise provided for, application thereof3%
E06BFixed or movable closures for openings in buildings, vehicles, fences or like enclosures in general, e.g. doors, windows, blinds, gates3%
PatentTitleYear
8,367,472'Method of fabricating a 3-D device'20138,053,807'Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages'20117,939,947'Semiconductor package structure'20117,915,710'Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate'20117,884,875'Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same'20117,825,468'Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages'20107,777,323'Semiconductor structure and method for forming the same'20107,777,345'Semiconductor device having through electrode and method of fabricating the same'20107,732,328'Method of fabricating semiconductor package structure'20107,602,047'Semiconductor device having through vias'20097,588,964'Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same'20097,534,656'Image sensor device and method of manufacturing the same'20097,521,657'Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same'20097,459,774'Stacked chip package using photosensitive polymer and manufacturing method thereof'20087,371,614'Image sensor device and methods thereof'20087,262,475'Image sensor device and method of manufacturing same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2013Patents assigned to SAMSUNG ELECTRONICS CO LTD (16)· patent assignee history
2007–2013Based in Suwon-si, KR· patent location history
2010–2011Based in Gyeonggi-do, KR· patent location history
2013Patents assigned to AHN EUN CHUL (1)· patent assignee history
2013Patents assigned to KWON YONG CHAI (1)· patent assignee history
2013Patents assigned to LEE DONG HO (1)· patent assignee history
2013Patents assigned to LEE JONG HO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 16 | 2007–2013 |
| AHN EUN CHUL | 1 | 2013 |
| KWON YONG CHAIself | 1 | 2013 |
| LEE DONG HO | 1 | 2013 |
| LEE JONG HO | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 12 | 2007–2013 |
| Gyeonggi-do, KR | 4 | 2010–2011 |