Inventor
Munehide Saimen
Inventor
Suwa, JP
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
B41JTypewriters15%
Y10TTechnical subjects covered by former us classification13%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein9%
H01LSemiconductor devices4%
H10NElectric solid-state devices not otherwise provided for4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
G09FDisplaying2%
PatentTitleYear
10,377,134MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method201910,029,459Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus20189,969,162MEMS device, liquid ejecting head, and liquid ejecting apparatus20189,919,523'Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus'20189,914,301'Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus'20189,908,331'MEMS device and liquid ejecting head'20189,844,939Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus20179,770,907'MEMS device, liquid ejecting head, and liquid ejecting apparatus'20179,684,197'Electro-optic device and electronic apparatus'20178,675,372'Electrooptic substrate, electrooptic device, and electronic apparatus'20148,640,582'Method for manufacturing flexible substrate and flexible substrate punching device'20148,391,020'Electro-optical device, electro-optical panel, and electronic apparatus'20138,289,492'Electro-optical device and electronic apparatus'20128,016,181'Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device'20117,901,528'Method for manufacturing wiring substrate having sheet'20117,704,793'Electronic part and method for manufacturing the same'20107,656,026'Semiconductor device'20107,582,955'Semiconductor device manufacturing method and manufacturing apparatus'20097,535,108'Electronic component including reinforcing member'20097,390,733'Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode'20087,385,142'Manufacturing method of electronic part and wiring substrate'20087,348,679'Electronic part having reinforcing member'20087,323,365'Semiconductor device manufacturing method and manufacturing apparatus'20087,316,939'Semiconductor device manufacturing method and manufacturing apparatus'20087,282,389'Semiconductor device manufacturing method and manufacturing apparatus'20077,190,065'Circuit substrate, semiconductor module and method of manufacturing circuit substrate'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2019Patents assigned to SEIKO EPSON CORP (26)· patent assignee history
2007–2010Based in Sakata, JP· patent location history
2007Based in Saka, JP· patent location history
2010–2019Based in Suwa, JP· patent location history
2012–2014Patents assigned to SAIMEN MUNEHIDE (4)· patent assignee history
2013Based in Nagano, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEIKO EPSON CORP | 26 | 2007–2019 |
| SAIMEN MUNEHIDEself | 4 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwa, JP | 15 | 2010–2019 |
| Sakata, JP | 9 | 2007–2010 |
| Nagano, JP | 1 | 2013 |
| Saka, JP | 1 | 2007 |