Inventor
BENJAMIN L. MCCLAIN
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
B28DWorking stone or stone-like materials5%
H05KPrinted circuits5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
12,087,720Semiconductor device assembly with surface-mount die support structures202412,080,678Methods and systems for manufacturing semiconductor devices202411,705,425Thermocompression bond tips and related apparatus and methods202311,670,612Method for solder bridging elimination for bulk solder C2S interconnects202311,594,432Cold fluid semiconductor device release during pick and place operations, and associated systems and methods202311,410,963Methods and systems for manufacturing semiconductor devices202211,410,962Methods and systems for manufacturing semiconductor devices2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to MICRON TECHNOLOGY INC (7)· patent assignee history
2022–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 7 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2024 |