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Inventor

Boe Su

Inventor
Chiayi, TW

Overview

3→
Patents
2006–2009
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,633,165'Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV'20097,187,078'Bump structure'20077,122,458'Method for fabricating pad redistribution layer'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2007Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2006–2009Based in Chiayi, TW· patent location history
2009Patents assigned to TAIWAN SEMICONDUCTOR MANFACTUR (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG22006–2007
TAIWAN SEMICONDUCTOR MANFACTUR12009
Locations
LocationPatentsSpan
Chiayi, TW32006–2009