Inventor
CHIA-LING WANG
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices36%
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
G06FElectric digital data processing7%
PatentTitleYear
12,538,768Semiconductor structure and fabrication method thereof202612,342,585Semiconductor structure and fabrication method thereof202512,310,071Semiconductor structure and fabrication method thereof202512,183,809Manufacturing method of semiconductor device202412,100,624Semiconductor device and method of fabricating the same202412,046,596Semiconductor structure and forming method thereof202411,436,134Method and apparatus for data integration framework2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to JPMORGAN CHASE BANK NA (1)· patent assignee history
2022Based in US· patent location history
2024–2026Patents assigned to UNITED MICROELECTRONICS CORP (6)· patent assignee history
2024–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 6 | 2024–2026 |
| JPMORGAN CHASE BANK NA | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2024–2026 |
| US | 1 | 2022 |