LexDanaLexDanabeta
Inventor

CHENG XU

Inventor
CN

Overview

90→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 90 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H01LSemiconductor devices12%
G09GArrangements or circuits for control of indicating devices using static means to present variable information11%
G06FElectric digital data processing7%
H10DInorganic electric semiconductor devices7%
H01FMagnets5%
H10KOrganic electric solid-state devices5%
H04LTransmission of digital information, e.g. telegraphic communication3%
H05KPrinted circuits3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
12,535,978Display device and signal synchronization method thereof, and pixel circuit202612,518,703Driving method and apparatus, and storage medium202612,520,594Display substrate, maintenance method and display device202612,520,683Multi-control area display substrate and driving method thereof, display device202612,512,392Package structure for reducing warpage of plastic package wafer and method for manufacturing the same202512,505,767Method for repairing defective pixel, display module and display apparatus202512,501,777Display panel and semiconductor device202512,488,729Driving circuit, display substrate and display device202512,466,734Preparation method of high-safety high-capacity lithium manganese iron phosphate202512,462,758Grid-driving-circuit array and display panel202512,451,053Method for compensating display panel and apparatus for compensating display panel, computer device, and computer-readable storage medium202512,444,361Display substrate and driving method thereof202512,424,130Compensating method and apparatus for display panel, and display device202512,367,815Display substrate and display device202512,354,544Driving circuit, driving method and display device202512,347,389Driving circuit, driving module, driving method, display substrate and display device202512,347,370Compensation method and apparatus for display device, and storage medium202512,342,619Array substrate, display panel, display apparatus, and method for manufacturing array substrate202512,340,743Signal selection circuit and method of display panel, and display device202512,314,524Touch substrate, design structure of touch electrode layer, display panel, and display device202512,288,744Microelectronic assemblies having conductive structures with different thicknesses on a core substrate202512,288,525Method of processing data, electronic device, and storage medium202512,288,516Display module and display device202512,283,248Circuitry structure and display substrate202512,262,597Display substrate and display device202512,248,926Automated teller machine and mobile computing device with synchronized displays202512,236,892Gate driver circuit and method for driving same, and display device202512,236,882Display panel and display method thereof, and display apparatus202512,230,210Display substrate and method of driving the same, display panel and display device202512,223,900Display substrate and display apparatus202512,183,281Display panel and display method thereof, and display apparatus202412,171,117Display substrate, manufacturing method thereof and display device202412,154,715Methods to selectively embed magnetic materials in substrate and corresponding structures2024D1046004Electric scooter202412,087,746Microelectronic assemblies having an integrated capacitor202412,026,106Dynamic compression for multiprocessor platforms and interconnects202411,942,909Amplifier and amplification method202411,901,115Substrate assembly with encapsulated magnetic feature202411,891,924Rocker arm mechanism and engine assembly202411,894,282Vented lids for integrated circuit packages202411,888,015X-ray sensor having a field limiting ring configuration202411,841,242Preprocessing method and device for distance transformation202311,830,809Magnetic structures in integrated circuit package supports202311,769,719Dual trace thickness for single layer routing202311,768,115Base resistance cancellation method and related methods, systems, and devices202311,761,263Balance force component for cordless window shades202311,735,537Methods to embed magnetic material as first layer on coreless substrates and corresponding structures202311,721,677Microelectronic assemblies having an integrated capacitor202311,705,389Vias for package substrates202311,696,407Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate202311,651,885Magnetic core inductors202311,647,481IP address geo-position detection based on landmark sequencing202311,646,254Electronic device including a lateral trace202311,620,367Key specific fingerprint based access control202311,557,489Cavity structures in integrated circuit package supports202311,557,579Microelectronic assemblies having an integrated capacitor202311,539,521Context based secure communication202211,521,914Microelectronic assemblies having a cooling channel202211,518,432Zero point compensation method and device for electric power steering202211,508,636Multi-layer solution based deposition of dielectrics for advanced substrate architectures202211,502,017Effective heat conduction from hotspot to heat spreader through package substrate202211,486,273Variable valve driving mechanism of engine, and engine202211,480,710Weather data collection through incentivized and collaborative drone flights202211,482,471Thermal management solutions for integrated circuit packages202211,450,471Methods to selectively embed magnetic materials in substrate and corresponding structures202211,443,892Substrate assembly with encapsulated magnetic feature202211,429,795Machine translation integrated with user analysis202211,417,614Methods to embed magnetic material as first layer on coreless substrates and corresponding structures202211,393,016Smart meal ordering method and device202211,387,224Phase change material in substrate cavity202211,380,609Microelectronic assemblies having conductive structures with different thicknesses on a core substrate202211,361,143Proactive rich text format management202211,355,459Embedding magnetic material, in a cored or coreless semiconductor package202211,347,381Dynamic synchronized image text localization202211,335,632Magnetic inductor structures for package devices202211,322,290Techniques for an inductor at a first level interface202211,312,375Vehicle anti-collision forewarning method, system and in-vehicle computer device202211,310,182Group communication organization202211,283,616Method for index-based and integrity-assured search in a blockchain202211,248,930Microclimate wind forecasting202211,246,218Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate202211,225,291Vehicle body structure and vehicle202211,229,001IP address geo-position detection based on landmark sequencing202211,220,269Fording depth estimation202211,217,534Galvanic corrosion protection for semiconductor packages202211,197,639Diagnosis using a digital oral device202111,200,333File exposure to an intended recipient202111,175,742Media sharing with visualized positioning layout in real time202111,150,739Chinese character entry via a Pinyin input method202111,144,779Real-time micro air-quality indexing2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2023Patents assigned to IBM (16)· patent assignee history
2021–2026Based in CN· patent location history
2022–2025Patents assigned to INTEL CORP (29)· patent assignee history
2022–2025Based in US· patent location history
2024–2026Patents assigned to BOE TECHNOLOGY GROUP CO LTD (28)· patent assignee history
2024–2026Patents assigned to HEFEI BOE JOINT TECH CO LTD (17)· patent assignee history
2024Based in SE· patent location history
2025Patents assigned to BEIJING BOE TECHNOLOGY DEV CO LTD (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP292022–2025
BOE TECHNOLOGY GROUP CO LTD282024–2026
HEFEI BOE JOINT TECH CO LTD172024–2026
IBM162021–2023
BEIJING BOE TECHNOLOGY DEV CO LTD42025
Locations
LocationPatentsSpan
CN582021–2026
US312022–2025
SE12024