Inventor
SHUSAKU SHIBATA
Inventor
JP
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits53%
G11BInformation storage based on relative movement between record carrier and transducer7%
H01LSemiconductor devices7%
H04NPictorial communication, e.g. television7%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y02PClimate change mitigation technologies in the production or processing of goods7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
12,598,703Wiring circuit board202612,598,698Wiring circuit board202612,507,341Wiring circuit board and producing method thereof202512,284,757Wiring circuit board202512,238,859Wiring circuit board202512,238,858Wiring circuit board202512,137,522Wiring circuit board202412,120,829Wiring circuit board assembly sheet202412,114,438Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit board202411,647,269Imaging element-mounting board202311,627,661Wired circuit board and imaging device202311,337,302Wiring circuit board202211,297,711Wiring circuit board and producing method thereof202211,266,024Wired circuit board and production method thereof202211,229,116Board assembly sheet202211,183,448Wiring circuit board and imaging device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to NITTO DENKO CORP (16)· patent assignee history
2021–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 16 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 16 | 2021–2026 |