Inventor
YI KOAN HONG
Inventor
KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
12,107,109Semiconductor device including through via, semiconductor package, and method of fabricating the same202411,791,211Semiconductor devices including through vias and methods of fabricating the same202311,626,443Semiconductor device including through via, semiconductor package, and method of fabricating the same202311,295,981Semiconductor devices including through vias and methods of fabricating the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history
2022–2024Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 4 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 4 | 2022–2024 |