Inventor
SHINENG MA
Inventor
CN
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
G11CStatic stores13%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
H01HElectric switches6%
H05KPrinted circuits6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
11,508,644Semiconductor device package having thermally conductive pathways202211,425,817Side contact pads for high-speed memory card202211,355,485Semiconductor die and semiconductor package202211,276,669High capacity semiconductor device including bifurcated memory module202211,177,239Semiconductor device including control switches to reduce pin capacitance2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to SANDISK INFORMATION TECH SHANGHAI CO LTD (1)· patent assignee history
2021–2022Based in CN· patent location history
2022Patents assigned to WESTERN DIGITAL TECH INC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WESTERN DIGITAL TECH INC | 4 | 2022 |
| SANDISK INFORMATION TECH SHANGHAI CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 5 | 2021–2022 |