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Inventor

Helmut Seehofer

Inventor
Burghausen, DE

Overview

2→
Patents
2010–2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B28Dprimary
B28DWorking stone or stone-like materials25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
B23DPlaning13%
B24BMachines, devices, or processes for grinding or polishing13%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables13%
Y10TTechnical subjects covered by former us classification13%
PatentTitleYear
10,245,661Wire guide roll for wire saw and method20197,766,724'Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2019Patents assigned to SILTRONIC AG (2)· patent assignee history
2010–2019Based in Burghausen, DE· patent location history
2019Patents assigned to AUER ENGELBERT (1)· patent assignee history
2019Patents assigned to HUBER ANTON (1)· patent assignee history
2019Patents assigned to SCHOENHOFER MANFRED (1)· patent assignee history
2019Patents assigned to SEEHOFER HELMUT (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SILTRONIC AG22010–2019
AUER ENGELBERT12019
HUBER ANTON12019
SCHOENHOFER MANFRED12019
SEEHOFER HELMUTself12019
Locations
LocationPatentsSpan
Burghausen, DE22010–2019