LexDanaLexDanabeta
Inventor

HEE KONG PHOON

Inventor
MY

Overview

3→
Patents
2023–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H03KPulse technique33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
12,394,713Fabric die to fabric die interconnect for modularized integrated circuit devices202512,009,298Fabric die to fabric die interconnect for modularized integrated circuit devices202411,670,589Fabric die to fabric die interconnect for modularized integrated circuit devices2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2025Patents assigned to INTEL CORP (3)· patent assignee history
2023–2025Based in MY· patent location history
2025Patents assigned to ALTERA CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP32023–2025
ALTERA CORP12025
Locations
LocationPatentsSpan
MY32023–2025