Inventor
MANISH CHANDHOK
Inventor
US
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10DInorganic electric semiconductor devices11%
H10BElectronic memory devices4%
H01GCapacitors3%
C01FCompounds of the metals beryllium, magnesium, aluminium, calcium, strontium, barium, radium, thorium, or of the rare-earth metals2%
C01GCompounds containing metals not covered by subclasses c01d or c01f2%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds2%
H04BTransmission2%
PatentTitleYear
12,581,927Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication202612,543,558Self-aligned interconnect features for transistor contacts202612,506,032—202512,482,744Subtractively patterned interconnect structures for integrated circuits202512,400,913Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication202512,341,092Planar slab vias for integrated circuit interconnects202512,342,551Capacitor architectures in semiconductor devices202512,293,913Directed self-assembly enabled subtractive metal patterning202512,266,527Directed self-assembly enabled patterning over metal layers using assisting features202512,261,114Metallization stacks with self-aligned staggered metal lines202512,237,223Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication202512,230,536Self-assembled guided hole and via patterning over grating202512,218,052Advanced lithography and self-assembled devices202512,176,214Selective metal removal for conductive interconnects in integrated circuitry202412,131,991Self aligned gratings for tight pitch interconnects and methods of fabrication202412,087,836Contact over active gate structures with metal oxide-caped contacts to inhibit shorting202412,087,594Colored gratings in microelectronic structures202412,080,639Contact over active gate structures with metal oxide layers to inhibit shorting202412,027,458Subtractively patterned interconnect structures for integrated circuits202411,990,403Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom202411,901,404Capacitor architectures in semiconductor devices202411,894,270Grating replication using helmets and topographically-selective deposition202411,887,887Interconnect structures and methods of fabrication202411,862,463Metal oxide nanoparticles as fillable hardmask materials202411,854,787Advanced lithography and self-assembled devices202311,837,542Interconnects having a portion without a liner material and related structures, devices, and methods202311,837,644Contact over active gate structures with metal oxide-caped contacts to inhibit shorting202311,791,375Capacitor architectures in semiconductor devices202311,664,305Staggered lines for interconnect performance improvement and processes for forming such202311,557,536Integrated circuits (IC's) with electro-migration (EM)--resistant segments in an interconnect level202311,444,024Subtractively patterned interconnect structures for integrated circuits202211,417,567Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom202211,404,307Interconnect structures and methods of fabrication202211,404,482Self-aligned repeatedly stackable 3D vertical RRAM202211,373,950Advanced lithography and self-assembled devices202211,335,598Grating replication using helmets and topographically-selective deposition202211,264,325Interconnects having a portion without a liner material and related structures, devices, and methods202211,264,449Capacitor architectures in semiconductor devices202211,251,117Self aligned gratings for tight pitch interconnects and methods of fabrication202211,239,112Passivating silicide-based approaches for conductive via fabrication and structures resulting therefrom202211,239,156Planar slab vias for integrated circuit interconnects202211,227,766Metal oxide nanoparticles as fillable hardmask materials202211,158,515Selective metal removal for conductive interconnects in integrated circuitry202111,152,254Pitch quartered three-dimensional air gaps2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (44)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 44 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 44 | 2021–2026 |