Inventor

Aizo Kaneda

Inventor

Yokohama, JP

Overview

1978–2005

Patent span

Electricity

Primary field (CPC H)

Patents· 50 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%

H05KPrinted circuits20%

H10DInorganic electric semiconductor devices17%

Y10TTechnical subjects covered by former us classification8%

B29CShaping or joining of plastics7%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%

G11CStatic stores2%

C09JAdhesives2%

G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2%

PatentTitleYear

6,919,622'Semiconductor device'2005 6,720,208'Semiconductor device'2004 6,621,170'Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film'2003 6,531,760'Semiconductor device'2003 6,326,681'Semiconductor device'2001 6,303,982'Semiconductor device'2001 6,265,782'Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film'2001 6,204,552'Semiconductor device'2001 6,130,114'Semiconductor device'2000 6,124,629'Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip'2000 6,100,115'Semiconductor device'2000 6,100,580'Semiconductor device having all outer leads extending from one side of a resin member'2000 6,081,023'Semiconductor device'2000 6,072,231'Semiconductor device'2000 6,069,029'Semiconductor device chip on lead and lead on chip manufacturing'2000 6,018,191'Semiconductor device'2000 5,981,315'Semiconductor device'1999 5,914,530'Semiconductor device'1999 5,863,817'Semiconductor device'1999 5,821,606'Semiconductor device'1998 5,793,099'Semiconductor device'1998 5,742,101'Semiconductor device'1998 5,612,569'Semiconductor device'1997 5,530,286'Semiconductor device'1996 5,514,905'Semiconductor device'1996 5,365,113'Semiconductor device'1994 5,358,904'Semiconductor device'1994 5,334,875'Stacked semiconductor memory device and semiconductor memory module containing the same'1994 5,219,765'Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process'1993 5,198,888'Semiconductor stacked device'1993 5,184,208'Semiconductor device'1993 5,125,821'Resin flow and curing measuring device'1992 5,110,515'Method of encapsulating semiconductor chips'1992 5,068,712'Semiconductor device'1991 5,059,559'Method of aligning and bonding tab inner leads'1991 5,028,986'Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices'1991 4,954,301'Transfer molding process and an apparatus for the same'1990 4,946,633'Method of producing semiconductor devices'1990 4,900,501'Method and apparatus for encapsulating semi-conductors'1990 4,810,089'Photoelastic effect measuring device'1989 4,802,831'Fluid machine with resin-coated scroll members'1989 4,786,802'Apparatus for measuring photoelasticity'1988 4,753,515'Method for assembling flat type plastic multifiber connectors'1988 4,524,369'Plastic information-recording medium'1985 4,484,796'Optical fiber connector'1984 4,426,341'Transfer molding method and transfer molding machine'1984 4,411,609'Apparatus for molding plastic'1983 4,322,593'Apparatus for pre-heating resin tablet'1982 4,239,944'Spider of loudspeaker'1980 4,126,292'Mold die'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–2001Patents assigned to HITACHI LTD (44)· patent assignee history

1978–2005Based in Yokohama, JP· patent location history

1988Patents assigned to HITACHI CONSTRUCTION MACHINERY (1)· patent assignee history

1992Based in Fujisawa, JP· patent location history

1993–1994Patents assigned to HITACHI TOBU SEMICONDUCTOR LTD (2)· patent assignee history

1993Based in Shimodate, JP· patent location history

2001–2003Patents assigned to HITACHI CHEMICAL CO LTD (2)· patent assignee history

2003Based in Yokohama-shi, Kanagawa, JP· patent location history

2004–2005Patents assigned to RENESAS TECH CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	44	1978–2001
HITACHI CHEMICAL CO LTD	2	2001–2003
HITACHI TOBU SEMICONDUCTOR LTD	2	1993–1994
RENESAS TECH CORP	2	2004–2005
HITACHI CONSTRUCTION MACHINERY	1	1988

Locations

Location	Patents	Span
Yokohama, JP	47	1978–2005
Yokohama-shi, Kanagawa, JP	1	2003
Shimodate, JP	1	1993
Fujisawa, JP	1	1992