Inventor
HAIYANG LIU
Inventor
CN
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Jprimary
H01JElectric discharge tubes or discharge lamps18%
G06FElectric digital data processing6%
A63FCard, board, or roulette games4%
B08BCleaning in general4%
F03HProducing a reactive propulsive thrust, not otherwise provided for4%
F21SNon-portable lighting devices4%
F21VFunctional features or details of lighting devices or systems thereof4%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted4%
H04LTransmission of digital information, e.g. telegraphic communication4%
H04WWireless communication networks4%
PatentTitleYear
12,567,168Data processing method and apparatus, device, and readable storage medium202612,531,215Plasma processing system and multi-section faraday shielding device thereof202612,519,645Service information communication method and electronic device202612,518,943Ion source baffle, ion etching machine, and usage method therefor202612,503,303—202512,494,346Ceramic air inlet radio frequency connection type cleaning device202512,352,416Lighting device202512,293,260Generating and deploying packages for machine learning at edge devices202512,264,811Rechargeable wall lamp2025D1067491Wall lamp202512,243,713Anti-breakdown ion source discharge apparatus202512,194,378Information processing method, system, apparatus, device, and storage medium202512,156,323High-temperature superconducting plasma thruster system having variable temperature ranges and being applied in space202412,112,923Reaction chamber lining202412,009,188Rotatable faraday cleaning apparatus and plasma processing system202411,995,453Method and apparatus for generating image file and computer-readable storage medium202411,955,323Device for blocking plasma backflow in process chamber to protect air inlet structure202411,837,439Inductively coupled plasma treatment system202311,781,535Cooling structure of heat pipe for superconducting magneto plasma dynamic thruster202311,735,400Faraday cleaning device and plasma processing system202311,608,867High-strength and high-thermal conductivity new material composite brake drum and preparation method thereof202311,485,897Ternary water control and gas recovery method suitable for unconsolidated siltstone gas reservoir202211,436,566Techniques for presenting a contextual contact list2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Based in CN· patent location history
2022–2025Based in US· patent location history
2023–2026Patents assigned to JIANGSU LEUVEN INSTR CO LTD (9)· patent assignee history
2023–2024Patents assigned to HEFEI INST PHYSICAL SCI CAS (2)· patent assignee history
2024–2026Patents assigned to TENCENT TECH SHENZHEN CO LTD (3)· patent assignee history
2025Patents assigned to LIU HAIYANG (3)· patent assignee history
2025Patents assigned to AMAZON TECH INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JIANGSU LEUVEN INSTR CO LTD | 9 | 2023–2026 |
| LIU HAIYANGself | 3 | 2025 |
| TENCENT TECH SHENZHEN CO LTD | 3 | 2024–2026 |
| HEFEI INST PHYSICAL SCI CAS | 2 | 2023–2024 |
| AMAZON TECH INC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 21 | 2022–2026 |
| US | 2 | 2022–2025 |