Inventor
EUNG SAN CHO
Inventor
US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices36%
H01QAntennas, i.e. radio aerials11%
H05KPrinted circuits7%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
H01GCapacitors2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
12,532,737Semiconductor device package thermally coupled to passive element202612,369,253Circuit and connector element alignment, circuit board assemblies202512,300,874Antenna package with via structure and method of formation thereof202512,272,862Antenna apparatus and fabrication method202512,255,114Embedded package with electrically isolating dielectric liner202512,014,964Semiconductor package having an electrically insulating core with exposed glass fibres202411,973,063Semiconductor package with low parasitic connection to passive device202411,916,007Semiconductor device with embedded flexible circuit202411,881,437Embedded package with electrically isolating dielectric liner202411,870,130Antenna apparatus and fabrication method202411,817,617Antenna package with via structure and method of formation thereof202311,776,882Method of fabricating a semiconductor package202311,532,541Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die202211,502,012Semiconductor packages and methods of manufacturing thereof202211,469,164Space efficient and low parasitic half bridge202211,302,610Semiconductor package and method of fabricating a semiconductor package202211,258,162Antenna package and method of formation thereof202211,152,321Semiconductor device having a copper pillar interconnect structure2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INFINEON TECHNOLOGIES AG (15)· patent assignee history
2021–2024Patents assigned to INFINEON TECHNOLOGIES AMERICAS CORP (2)· patent assignee history
2021–2026Based in US· patent location history
2022–2025Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 15 | 2021–2026 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 3 | 2022–2025 |
| INFINEON TECHNOLOGIES AMERICAS CORP | 2 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 18 | 2021–2026 |