Inventor

CHEN-SHIEN CHEN

Inventor

TW

Overview

2021–2025

Patent span

Electricity

Primary field (CPC H)

Patents· 74 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices36%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%

H10DInorganic electric semiconductor devices7%

H01FMagnets4%

H10NElectric solid-state devices not otherwise provided for2%

Y10TTechnical subjects covered by former us classification2%

G01RMeasuring electric variables0%

H02JElectric power networks0%

H05KPrinted circuits0%

PatentTitleYear

12,494,379Heterogeneous bonding structure and method forming same2025 12,451,396Semiconductor package and method of forming same2025 12,444,706Package bonding structures and method of formation2025 12,388,003Chip package structure with metal-containing layer2025 12,376,317Semiconductor device structure with magnetic element2025 12,368,120Semiconductor device and method2025 12,347,722Semiconductor device structure with a protection cap at an end portion of a conductive line2025 12,334,476Semiconductor device with discrete blocks2025 12,334,489Lthc as charging barrier in info package formation2025 12,327,782Systems for semiconductor package mounting with improved co-planarity2025 12,300,652Substrate and package structure2025 12,300,644Die bonding pads and methods of forming the same2025 12,293,951Semiconductor package structure having ring portion with recess for adhesive2025 12,159,812Method of forming semiconductor device2024 12,131,974Semiconductor package and method of manufacturing semiconductor package2024 12,125,715Chip package structure with nickel layer2024 12,119,276Package structure with protective lid2024 12,119,237Semiconductor device package having metal thermal interface material2024 12,113,055Stress reduction apparatus and method2024 12,087,718Bump structure having a side recess and semiconductor structure including the same2024 12,074,193Semiconductor device structure with magnetic element2024 12,051,634Package and package-on-package structure having elliptical columns and ellipsoid joint terminals2024 12,046,588Package on package structure2024 12,040,289Interposer including a copper edge seal ring structure and methods of forming the same2024 12,027,435Packages including multiple encapsulated substrate blocks and overlapping redistribution structures2024 12,019,097Method for forming probe head structure2024 12,002,746Chip package structure with metal-containing layer2024 11,984,419Package structure with a barrier layer2024 11,978,720Semiconductor device package and methods of manufacture2024 11,961,791Package structures and methods for forming the same2024 11,961,810Solderless interconnection structure and method of forming same2024 11,923,353LTHC as charging barrier in info package formation2024 11,908,885Semiconductor device structure with magnetic element2024 11,894,332Substrate and package structure2024 11,894,241Heterogeneous bonding structure and method forming same2024 11,862,588Semiconductor device and method2024 11,855,025Semiconductor device and package assembly including the same2023 11,854,835Heterogeneous bonding structure and method forming same2023 11,855,045Semiconductor device with discrete blocks2023 11,842,935Method for forming a reconstructed package substrate comprising substrates blocks2023 11,824,026Connector structure and method of forming same2023 11,764,118Structure and formation method of chip package with protective lid2023 11,764,168Chip package structure with anchor structure and method for forming the same2023 11,756,849Package and package-on-package structure having elliptical columns and ellipsoid joint terminals2023 11,749,711Semiconductor device structure with magnetic element2023 11,749,575Semiconductor package structure having ring portion with recess for adhesive and method for forming the same2023 11,742,217Passive devices in package-on-package structures and methods for forming the same2023 11,742,218Semiconductor device package having metal thermal interface material and method for forming the same2023 11,728,180Chip package structure with conductive adhesive layer2023 11,682,651Bump-on-trace interconnect2023 11,658,143Bump-on-trace design for enlarge bump-to-trace distance2023 11,631,993Wireless charging devices having wireless charging coils and methods of manufacture thereof2023 11,631,648Bump structure having a side recess and semiconductor structure including the same2023 11,621,317Semiconductor device structure with magnetic element covered by polymer material2023 11,557,508Semiconductor device structure having protection caps on conductive lines2023 11,488,878Packaging mechanisms for dies with different sizes of connectors2022 11,476,125Multi-die package with bridge layer2022 11,469,203Method for forming package structure with a barrier layer2022 11,437,361LTHC as charging barrier in InFO package formation2022 11,404,341Package and package-on-package structure having elliptical columns and ellipsoid joint terminals2022 11,387,168Semiconductor devices2022 11,387,171Method of packaging a semiconductor die2022 11,342,253Package structures and methods for forming the same2022 11,335,634Chip package structure and method for forming the same2022 11,329,124Semiconductor device structure with magnetic element2022 11,329,008Method for manufacturing semiconductor package for warpage control2022 11,315,896Conical-shaped or tier-shaped pillar connections2022 11,302,537Chip package structure with conductive adhesive layer and method for forming the same2022 11,257,797Package on package structure2022 11,244,919Package structure and method of fabricating the same2022 11,244,940Stress reduction apparatus and method2022 11,233,116Semiconductor device structure with magnetic element2022 11,217,562Semiconductor device with discrete blocks2022 11,152,319Micro-connection structure and manufacturing method thereof2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (74)· patent assignee history

2021–2025Based in TW· patent location history

2022Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	74	2021–2025

Locations

Location	Patents	Span
TW	73	2021–2025
CN	1	2022