Inventor
LIANGFA HU
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
C23CCoating metallic material17%
H01JElectric discharge tubes or discharge lamps17%
B08BCleaning in general8%
H01FMagnets8%
PatentTitleYear
12,539,530Throttle valve and foreline cleaning using a microwave source202612,334,384Methods and apparatus for minimizing substrate backside damage202511,756,819Methods and apparatus for minimizing substrate backside damage202311,560,623Methods of reducing chamber residues202311,515,066Heat treatable magnets having improved alignment through application of external magnetic field during binder-assisted molding202211,515,150Hardmask tuning by electrode adjustment2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to APPLIED MATERIALS INC (5)· patent assignee history
2022Patents assigned to UNIV IOWA STATE RES FOUND INC (1)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 5 | 2022–2026 |
| UNIV IOWA STATE RES FOUND INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2026 |