Inventor
Wataru Nakayama
Inventor
Kashiwa, JP
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
F28Fprimary
F28FDetails of heat-exchange and heat-transfer apparatus, of general application18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
G01RMeasuring electric variables6%
Y10TTechnical subjects covered by former us classification6%
B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling5%
H01FMagnets5%
H02KDynamo-electric machines5%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
B01DSeparation3%
PatentTitleYear
10,833,623Electric power control unit202010,809,137Method of estimating temperature of reactor202010,393,774Bus bar module201910,295,571Bus bar module201910,184,960Current sensor201910,153,720Power supply system for electric vehicle20187,586,219'Drive guide apparatus'20097,556,086'Orientation-independent thermosyphon heat spreader'20097,368,837'Drive guide device'20085,930,464'Apparatus for controlling a direct memory access operation in an image processing apparatus'1999RE035721'Cooling device of semiconductor chips'19984,949,164'Semiconductor cooling apparatus and cooling method thereof'19904,823,863'Thermal conduction device'19894,794,775'Method of producing a heat transfer tube for single-phase flow'19894,770,242'Cooling device of semiconductor chips'19884,715,436'Construction of a heat transfer wall of a heat transfer pipe'19874,694,378'Apparatus for cooling integrated circuit chips'19874,690,211'Heat transfer tube for single phase flow'19874,678,029'Evaporating heat transfer wall'19874,653,163'Method for producing a heat transfer wall for vaporizing liquids'19874,619,316'Heat transfer apparatus'19864,606,405'Heat transfer wall'19864,602,681'Heat transfer surface with multiple layers'19864,585,055'Liquid film evaporation type heat exchanger'19864,561,497'Heat transfer surface and manufacturing method for same'19854,520,866'Falling film evaporation type heat exchanger'19854,431,980'Electrical apparatus winding'19844,363,013'Winding structure for static electrical induction apparatus'19824,363,012'Winding structure for static electrical induction apparatus'19824,335,324'Rotor for hydrogen-cooled rotary electric machines'19824,311,931'Rotor for hydrogen-cooled rotary electric machines'19824,246,503'Gas flow cooling system for a rotary electric machine'19814,245,206'Winding structure for static electrical induction apparatus'19814,207,550'Winding structure of electric devices'19804,195,688'Heat-transfer wall for condensation and method of manufacturing the same'19804,194,384'Method of manufacturing heat-transfer wall for vapor condensation'19804,166,498'Vapor-condensing, heat-transfer wall'19794,060,125'Heat transfer wall for boiling liquids'19774,044,797'Heat transfer pipe'1977Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1977–1998Patents assigned to HITACHI LTD (27)· patent assignee history
1977–1989Patents assigned to HITACHI CABLE (11)· patent assignee history
1977–1998Based in Kashiwa, JP· patent location history
2008–2009Patents assigned to THK CO LTD (2)· patent assignee history
2008–2009Based in Tokyo, JP· patent location history
2018–2019Patents assigned to TOYOTA MOTOR CO LTD (4)· patent assignee history
2018Based in Miyoshi, JP· patent location history
2019Based in Toyota, JP· patent location history
2020Patents assigned to DENSO CORP (2)· patent assignee history
2020Based in Nisshin, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 27 | 1977–1998 |
| HITACHI CABLE | 11 | 1977–1989 |
| TOYOTA MOTOR CO LTD | 4 | 2018–2019 |
| DENSO CORP | 2 | 2020 |
| THK CO LTD | 2 | 2008–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kashiwa, JP | 29 | 1977–1998 |
| Toyota, JP | 3 | 2019 |
| Nisshin, JP | 2 | 2020 |
| Tokyo, JP | 2 | 2008–2009 |
| Miyoshi, JP | 1 | 2018 |