Inventor
In-Ku Kang
Inventor
Cheonan-si, KR
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H01LSemiconductor devices9%
H04LTransmission of digital information, e.g. telegraphic communication9%
H04WWireless communication networks9%
H10DInorganic electric semiconductor devices9%
G06FElectric digital data processing6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
A23NMachines or apparatus for treating harvested fruit, vegetables or flower bulbs in bulk, not otherwise provided for2%
B26DCutting2%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%
PatentTitleYear
10,599,410Method and electronic device for updating configuration settings202010,581,833Electronic device and method for processing secure information202010,305,883Electronic device and method for commonly using the same201910,204,869Integrated circuit package including shielding between adjacent chips20199,978,693Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit package20189,872,180'Method for managing network access and electronic device therefor'20189,129,846'Semiconductor package and method of forming'20158,890,330'Semiconductor packages and electronic systems including the same'20148,253,232'Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same'20128,178,393'Semiconductor package and manufacturing method thereof'20128,008,765'Semiconductor package having adhesive layer and method of manufacturing the same'20117,843,051'Semiconductor package and method of fabricating the same'20107,521,810'Chip stack package and manufacturing method thereof'20097,485,955'Semiconductor package having step type die and method for manufacturing the same'20097,371,675'Method and apparatus for bonding a wire'20087,368,811'Multi-chip package and method for manufacturing the same'20087,282,431'Single chip and stack-type chip semiconductor package and method of manufacturing the same'20077,176,558'Single chip and stack-type chip semiconductor package and method of manufacturing the same'20077,109,065'Bumped chip carrier package using lead frame and method for manufacturing the same'20067,098,407'Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate'20067,067,413'Wire bonding method, semiconductor chip, and semiconductor package'20067,030,489'Multi-chip module having bonding wires and method of fabricating the same'20066,977,439'Semiconductor chip stack structure'20056,818,976'Bumped chip carrier package using lead frame'20046,448,661'Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Patents assigned to SAMSUNG ELECTORNICS CO LTD (1)· patent assignee history
2002–2007Based in Chungcheongnam-do, KR· patent location history
2004–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (24)· patent assignee history
2004–2009Based in Cheonan-si, KR· patent location history
2010–2020Based in Gyeonggi-do, KR· patent location history
2011–2015Based in Suwon-si, KR· patent location history
2012Patents assigned to KANG IN-KU (2)· patent assignee history
2012Patents assigned to KIM KYUNG-MAN (1)· patent assignee history
2018–2019Based in Gunpo-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 24 | 2004–2020 |
| KANG IN-KUself | 2 | 2012 |
| KIM KYUNG-MAN | 1 | 2012 |
| SAMSUNG ELECTORNICS CO LTD | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 7 | 2004–2009 |
| Suwon-si, KR | 5 | 2011–2015 |
| Chungcheongnam-do, KR | 5 | 2002–2007 |
| Gyeonggi-do, KR | 3 | 2010–2020 |
| Gunpo-si, KR | 2 | 2018–2019 |