Inventor
Huchang Zhang
Inventor
Tianjin, CN
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
B23KSoldering or unsoldering7%
B28DWorking stone or stone-like materials7%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables7%
PatentTitleYear
9,498,898'Cleaning mechanism for semiconductor singulation saws'20169,406,625'Die edge seal employing low-K dielectric material'20169,397,066'Bond wire feed system and method therefor'20169,252,114'Semiconductor device grid array package'20169,214,413'Semiconductor die package with pre-molded die'20158,735,223'Semiconductor devices and methods of assembling same'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2016Patents assigned to ZHANG HUCHANG (6)· patent assignee history
2014–2016Patents assigned to FREESCALE SEMICONDUCTOR INC (5)· patent assignee history
2014–2016Based in Tianjin, CN· patent location history
2015–2016Patents assigned to BAI ZHIGANG (5)· patent assignee history
2015–2016Patents assigned to WANG ZHIJIE (5)· patent assignee history
2016Patents assigned to NIU JIYONG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ZHANG HUCHANGself | 6 | 2014–2016 |
| BAI ZHIGANG | 5 | 2015–2016 |
| FREESCALE SEMICONDUCTOR INC | 5 | 2014–2016 |
| WANG ZHIJIE | 5 | 2015–2016 |
| NIU JIYONG | 2 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tianjin, CN | 6 | 2014–2016 |